描述
無描述配置
Single chamber tool PECVD. 8" In Fab still running.OEM 代工型號說明
The Plasma-Therm 790 series is a self-contained Reactive Ion Etching (RIE) system that features a showerhead gas distribution system and a water-cooled RF platen. This system is capable of etching silicon, silicon dioxide, and silicon nitride. The chamber can achieve a base pressure in the range of 3x10-5 Torr and can operate within a pressure range of 10mTorr to 100mTorr. The system is controlled by a PC and offers both manual and automatic operation modes. It has four process gases available: CF4, CHF3, SF6, and O2.文檔
無文檔
PLASMATHERM
790
已驗證
類別
Dry / Plasma Etch
上次驗證: 超過30天前
關鍵商品詳情
條件:
Used
作業狀態:
Installed / Running
產品編號:
105081
晶圓尺寸:
8"/200mm
年份:
1993
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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PLASMATHERM
790
類別
Dry / Plasma Etch
上次驗證: 超過30天前
關鍵商品詳情
條件:
Used
作業狀態:
Installed / Running
產品編號:
105081
晶圓尺寸:
8"/200mm
年份:
1993
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
無描述配置
Single chamber tool PECVD. 8" In Fab still running.OEM 代工型號說明
The Plasma-Therm 790 series is a self-contained Reactive Ion Etching (RIE) system that features a showerhead gas distribution system and a water-cooled RF platen. This system is capable of etching silicon, silicon dioxide, and silicon nitride. The chamber can achieve a base pressure in the range of 3x10-5 Torr and can operate within a pressure range of 10mTorr to 100mTorr. The system is controlled by a PC and offers both manual and automatic operation modes. It has four process gases available: CF4, CHF3, SF6, and O2.文檔
無文檔