描述
無描述配置
-Precision High Performance Mask Alignment and Exposure System -Version: 75 MM -System capable of exposing partial wafers or substrates up to a maximum size of 3 in. dia. Hard or soft contact modes. -High precision alignment stage X,Y, Theta. -Microscope consists of normal field microscope with objective turret for different magnafications. 365 to 400nm spectral range up to 350W. 110V, 60 Hz.OEM 代工型號說明
"The MJB 3 is perfect or photolithography R&D. The product line offers flexibility in handling irregularly shaped substrates and pieces of different thickness, as well as standard size wafers up to 3"". Various configurations are available see individual listings for more details on light sources and alignment modes. The MBJ 3 offers three exposure modes: HP (high precision), ST (standard), SOFT CONT (soft contact). Capabilities: exposure of thin and thick resist materials, ultimate resolution ~ 1μm, substrates up to 75mm in diameter, masks up to 100 mm x 100 mm in size."文檔
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SUSS MicroTec / KARL SUSS
MJB3
已驗證
類別
Mask/Bond Aligners
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
62965
晶圓尺寸:
未知
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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SUSS MicroTec / KARL SUSS
MJB3
類別
Mask/Bond Aligners
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
62965
晶圓尺寸:
未知
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
無描述配置
-Precision High Performance Mask Alignment and Exposure System -Version: 75 MM -System capable of exposing partial wafers or substrates up to a maximum size of 3 in. dia. Hard or soft contact modes. -High precision alignment stage X,Y, Theta. -Microscope consists of normal field microscope with objective turret for different magnafications. 365 to 400nm spectral range up to 350W. 110V, 60 Hz.OEM 代工型號說明
"The MJB 3 is perfect or photolithography R&D. The product line offers flexibility in handling irregularly shaped substrates and pieces of different thickness, as well as standard size wafers up to 3"". Various configurations are available see individual listings for more details on light sources and alignment modes. The MBJ 3 offers three exposure modes: HP (high precision), ST (standard), SOFT CONT (soft contact). Capabilities: exposure of thin and thick resist materials, ultimate resolution ~ 1μm, substrates up to 75mm in diameter, masks up to 100 mm x 100 mm in size."文檔
無文檔