描述
無描述配置
Karl Suss MJB3-IR Mask Aligner with IR Transmission Alignment for Front or Backside Alignment. Microscope with long working distance objectives. IR transmission alignment system applicable to materials transparent to wavelengths in the range from 400 to 2000nm. The backside alignment is accomplished using an IR camera which detects infrared light transmitted through an IR transparent chuck, as well as the substrate and mask being aligned. The substrate can be exposed in soft or hard contact with both forms of alignment. Also in topside alignment the vacuum contact (high precision HP) is available. 110V, 60 Hz.OEM 代工型號說明
"The MJB 3 is perfect or photolithography R&D. The product line offers flexibility in handling irregularly shaped substrates and pieces of different thickness, as well as standard size wafers up to 3"". Various configurations are available see individual listings for more details on light sources and alignment modes. The MBJ 3 offers three exposure modes: HP (high precision), ST (standard), SOFT CONT (soft contact). Capabilities: exposure of thin and thick resist materials, ultimate resolution ~ 1μm, substrates up to 75mm in diameter, masks up to 100 mm x 100 mm in size."文檔
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SUSS MicroTec / KARL SUSS
MJB3
已驗證
類別
Mask/Bond Aligners
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
13966
晶圓尺寸:
未知
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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SUSS MicroTec / KARL SUSS
MJB3
類別
Mask/Bond Aligners
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
13966
晶圓尺寸:
未知
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
無描述配置
Karl Suss MJB3-IR Mask Aligner with IR Transmission Alignment for Front or Backside Alignment. Microscope with long working distance objectives. IR transmission alignment system applicable to materials transparent to wavelengths in the range from 400 to 2000nm. The backside alignment is accomplished using an IR camera which detects infrared light transmitted through an IR transparent chuck, as well as the substrate and mask being aligned. The substrate can be exposed in soft or hard contact with both forms of alignment. Also in topside alignment the vacuum contact (high precision HP) is available. 110V, 60 Hz.OEM 代工型號說明
"The MJB 3 is perfect or photolithography R&D. The product line offers flexibility in handling irregularly shaped substrates and pieces of different thickness, as well as standard size wafers up to 3"". Various configurations are available see individual listings for more details on light sources and alignment modes. The MBJ 3 offers three exposure modes: HP (high precision), ST (standard), SOFT CONT (soft contact). Capabilities: exposure of thin and thick resist materials, ultimate resolution ~ 1μm, substrates up to 75mm in diameter, masks up to 100 mm x 100 mm in size."文檔
無文檔