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SUSS MicroTec / KARL SUSS ABC200
    描述
    無描述
    配置
    無配置
    OEM 代工型號說明
    Wafer Bonding + Bond Alignment + Cleaning + Metal Oxide Removal + Plasma Activation Up to 200 mm
    文檔

    無文檔

    SUSS MicroTec / KARL SUSS

    ABC200

    verified-listing-icon

    已驗證

    類別
    Wafer Bonders

    上次驗證: 超過60天前

    關鍵商品詳情
    條件:

    Used

    作業狀態:

    未知

    產品編號:

    47196

    晶圓尺寸:

    未知

    年份:

    未知

    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    類似上架商品
    查看全部
    SUSS MicroTec / KARL SUSS ABC200

    SUSS MicroTec / KARL SUSS

    ABC200

    Wafer Bonders
    年份: 0條件: 二手
    上次驗證超過60天前
    SUSS MicroTec / KARL SUSS ABC200

    SUSS MicroTec / KARL SUSS

    ABC200

    Wafer Bonders
    年份: 0條件: 二手
    上次驗證超過60天前
    SUSS MicroTec / KARL SUSS ABC200

    SUSS MicroTec / KARL SUSS

    ABC200

    Wafer Bonders
    年份: 0條件: 二手
    上次驗證超過60天前
    SUSS MicroTec / KARL SUSS ABC200

    SUSS MicroTec / KARL SUSS

    ABC200

    Wafer Bonders
    年份: 2006條件: 二手
    上次驗證超過60天前
    SUSS MicroTec / KARL SUSS ABC200

    SUSS MicroTec / KARL SUSS

    ABC200

    Wafer Bonders
    年份: 0條件: 二手
    上次驗證超過60天前

    SUSS MicroTec / KARL SUSS

    ABC200

    verified-listing-icon
    已驗證
    類別
    Wafer Bonders
    上次驗證: 超過60天前
    listing-photo-c125c11a1d4c42028ccdb402e0182d9d-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1689/47196/e767962d3c174b9dbc3ec197c1b0d9df_29bebde0019241b5ac56148074b455b3image198_mw.jpeg
    listing-photo-c125c11a1d4c42028ccdb402e0182d9d-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1689/47196/d672943f6afe4a8db4a7ca1df0286b84_e42c4364f26e4131bfcea3693759cbe7image199_mw.jpeg
    listing-photo-c125c11a1d4c42028ccdb402e0182d9d-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1689/47196/8e869148c73848fa952d0d702166b98c_b875d2dd3313414fabb7d11835c389edimage200rotated_mw.jpeg
    listing-photo-c125c11a1d4c42028ccdb402e0182d9d-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1689/47196/3e28cc65577b4ea892cb741575656fba_cad0aa3839384a4bbce7cde1b638d595image201_mw.jpeg
    關鍵商品詳情
    條件:

    Used

    作業狀態:

    未知

    產品編號:

    47196

    晶圓尺寸:

    未知

    年份:

    未知

    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    描述
    無描述
    配置
    無配置
    OEM 代工型號說明
    Wafer Bonding + Bond Alignment + Cleaning + Metal Oxide Removal + Plasma Activation Up to 200 mm
    文檔

    無文檔

    類似上架商品
    查看全部
    SUSS MicroTec / KARL SUSS ABC200

    SUSS MicroTec / KARL SUSS

    ABC200

    Wafer Bonders年份: 0條件: 二手上次驗證:超過60天前
    SUSS MicroTec / KARL SUSS ABC200

    SUSS MicroTec / KARL SUSS

    ABC200

    Wafer Bonders年份: 0條件: 二手上次驗證:超過60天前
    SUSS MicroTec / KARL SUSS ABC200

    SUSS MicroTec / KARL SUSS

    ABC200

    Wafer Bonders年份: 0條件: 二手上次驗證:超過60天前
    SUSS MicroTec / KARL SUSS ABC200

    SUSS MicroTec / KARL SUSS

    ABC200

    Wafer Bonders年份: 2006條件: 二手上次驗證:超過60天前
    SUSS MicroTec / KARL SUSS ABC200

    SUSS MicroTec / KARL SUSS

    ABC200

    Wafer Bonders年份: 0條件: 二手上次驗證:超過60天前