SUSS MicroTec offers a wide product portfolio of high quality process solutions for the semiconductor industry and related markets. SUSS portfolio covers a comprehensive range of products and solutions for backend lithography, wafer bonding, and photomask processing, complemented by micro-optical components. 

SUSS MicroTec / KARL SUSS

SB200

SB6/8 Gen2

The universal XBS200 platform allows for aligned wafer bonding of wafer sizes up to 200 mm. Its versatility and modular design offer maximum process flexibility in all permanent bonding tasks. A novel aligned wafer transfer method eliminates the complexity of traditional systems and offers consistent process results with excellent system availability. The XBS200 platform offers low cost of ownership for high-volume production of MEMS, LED and 3D advanced packaging.

Wafer Bonder

XBS200

The SB8e and the SB6e (SB8e/6e) represent the latest generation technology in substrate bonders offering precision performance and flexibility in a user-friendly, high-quality package. The newly designed and enhanced SB8e/6e are semi-automatic, computer-controlled systems with both vacuum- and pressurecontrolled atmosphere capability featuring an ergonomic load/ unload station. The SB8e/6e delivers superior post bond alignment accuracy resulting from precision mechanics, uniform force capability and leading temperature control. When matched with SUSS’ bond aligners, BA8/6, they offer enabling capability for MEMS, 3-D interconnects, and opto-electronics. This generation’s bond chamber and tooling supports all types of bond processes with optimization especially for thermocompression bonding and the flexibility to switch to anodic bond tooling. The flexibility of these bond systems make them ideal and economical for laboratories and small series production. Yet, combined with SUSS’ patent-pending low temperature plasma activation module these systems offer enabling technology for fusion bonding of SOI, III/V, and SiGe compounds at temperatures down to 200°C.

Wafer Bonder

SB8e

SB150

NP12

SB8L

The XB8 wafer bonder is designed for a wide range of bonding processes and supports substrates with a wafer size of up to 200 mm. All process parameters can be adapted flexibly according to the requirements, which make the system perfect for use in research and development. In production, the high level of automation and the sophisticated design of the XB8 ensure a high level of process stability. This makes the XB8 wafer bonder ideal for applications from the MEMS, advanced packaging, 3D integration and LED fields.

The BA8 Gen4 Pro bond alignment platform is designed for demanding processes in MEMS and LED production and advanced packaging markets. It accurately aligns substrates and secures their position in fixtures for further process steps. The bond alignment of two wafers is based on the same powerful technology that has proven its value with SUSS MicroTec’s mask aligners for mask to wafer alignment. The platform can be configured as a bond aligner only or as a combination of mask and bond aligner. A direct bonding toolkit offers  extra functionality for pre-bonding substrates. In order to enhance direct bonding processes, the BA8 Gen4 Pro can be equipped with an optional toolkit for selective and full-wafer surface activation. It can easily be upgraded with additional functions within a short time. The system handles substrates up to 200 mm in size. With its ergonomic  operation and intuitive user interface, the BA8 Gen4 Pro is easy to work with and requires only minimal operator training. Its high  degree of automation allows for easy operation and an application in labs, research and development as well as small series production.

Wafer Bonder

BA8 Gen4 Pro

Wafer Bonding + Bond Alignment + Cleaning +  Metal Oxide Removal + Plasma Activation
Up to 200 mm 

ABC200

SB6e

The semi-automated bond aligner BA8 is designed for high-precision alignment and subsequent reliable bonding of wafers and substrates up to 200 mm.

Wafer Bonder

Wafer Bonding + Bond Alignment + Cleaning + Metal Oxide Removal + Plasma Activation
Up to 200 mm 

CBC200

CB200

CB200M

SB6/8 Gen2 SUSS MicroTec provides a semi-automated platform for multiple bonding processes. Handling wafers up to 200mm as well as various shapes and types of substrates the SB6/8 Gen2 presents itself as a flexible tool for various applications and process environments. The SB6/8 Gen2 is suitable for packaging as well structuring meeting the requirements for MEMS, LED, advanced packaging, 2,5D integration, and 3D integration.

SB8 Gen2 - from pieces up to 200mm wafers.

Wafer Bonder

SB8 Gen2

SB6/8 Gen2 SUSS MicroTec provides a semi-automated platform for multiple bonding processes. Handling wafers up to 200mm as well as various shapes and types of substrates the SB6/8 Gen2 presents itself as a flexible tool for various applications and process environments. The SB6/8 Gen2 is suitable for packaging as well structuring meeting the requirements for MEMS, LED, advanced packaging, 2,5D integration, and 3D integration.

SB6 Gen2 - from pieces up to 150mm wafers.

Wafer Bonder

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SUSS MicroTec / KARL SUSS

概述

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最熱門的 SUSS MicroTec / KARL SUSS Wafer Bonders

SB6/8 Gen2

XB8

BA8 Gen4 Pro

XBS200

SB6/8 Gen2

XB8

BA8 Gen4 Pro

XBS200

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