跳到主要內容
6" Fab For Sale from Moov - Click Here to Learn More
6" Fab For Sale from Moov - Click Here to Learn More
Moov logo

6" Fab For Sale from Moov - Click Here to Learn More
Moov Icon

XBS200

概述

The universal XBS200 platform allows for aligned wafer bonding of wafer sizes up to 200 mm. Its versatility and modular design offer maximum process flexibility in all permanent bonding tasks. A novel aligned wafer transfer method eliminates the complexity of traditional systems and offers consistent process results with excellent system availability. The XBS200 platform offers low cost of ownership for high-volume production of MEMS, LED and 3D advanced packaging. Wafer Bonder

活躍中的上架商品

0

服務

檢驗、保險、評估、物流

最熱門的上架商品

    未找到產品
有類似商品?
利用 Moov 將其上架並立即找到完美的買家。