描述
AUTOMATED PRODUCTION WAFER BONDING SYSTEM配置
無配置OEM 代工型號說明
Wafer Bonding + Bond Alignment + Cleaning + Metal Oxide Removal + Plasma Activation Up to 200 mm文檔
無文檔
SUSS MicroTec / KARL SUSS
ABC200
已驗證
類別
Wafer Bonders
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
41224
晶圓尺寸:
8"/200mm
年份:
2006
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
類似上架商品
查看全部
SUSS MicroTec / KARL SUSS
ABC200
類別
Wafer Bonders
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
41224
晶圓尺寸:
8"/200mm
年份:
2006
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
AUTOMATED PRODUCTION WAFER BONDING SYSTEM配置
無配置OEM 代工型號說明
Wafer Bonding + Bond Alignment + Cleaning + Metal Oxide Removal + Plasma Activation Up to 200 mm文檔
無文檔