描述
P-5000 Mark II DLH SACVD配置
CVD DxL SACVD TEOS SACVD (Chemical Vapor Deposition) Deposition Equipment Currently Configured for: 200mm Software: b6.02 MF: P5000 Mark II Qty 4 - DLH SACVD: TEOS Deposition Chuck: Anodized Aluminum MFCs: 24 Horiba Z500 Digital MFCs Robot: ROBOT ASSY 8 IN AMAT 5000 Dry Pumps: 4 IXH620, 1 Edwards IXL120 Chillers: AMAT Heatex 1 Edwards Atlas Abatement Upgrades: PLIS, V440 SBC Power glitch protection Known Missing Parts: Heater jackets, AI board Qty 1 ; Tool is not completeOEM 代工型號說明
The Applied Materials Precision 5000 CVD is a single system solution for depositing high-quality, low-temperature dielectric materials on semiconductor devices. It incorporates multi-step processes to provide enabling technology for void-free intermetal dielectric deposition with profile control. The system’s process flexibility over a wide range of applications reduces the number and types of machines required for CVD. This makes it an efficient and cost-effective solution for semiconductor manufacturing.文檔
無文檔
類別
CVD
上次驗證: 11 天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
125401
晶圓尺寸:
4"/100mm, 6"/150mm, 8"/200mm
年份:
1995
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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APPLIED MATERIALS (AMAT)
P5000 CVD
類別
CVD
上次驗證: 11 天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
125401
晶圓尺寸:
4"/100mm, 6"/150mm, 8"/200mm
年份:
1995
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
P-5000 Mark II DLH SACVD配置
CVD DxL SACVD TEOS SACVD (Chemical Vapor Deposition) Deposition Equipment Currently Configured for: 200mm Software: b6.02 MF: P5000 Mark II Qty 4 - DLH SACVD: TEOS Deposition Chuck: Anodized Aluminum MFCs: 24 Horiba Z500 Digital MFCs Robot: ROBOT ASSY 8 IN AMAT 5000 Dry Pumps: 4 IXH620, 1 Edwards IXL120 Chillers: AMAT Heatex 1 Edwards Atlas Abatement Upgrades: PLIS, V440 SBC Power glitch protection Known Missing Parts: Heater jackets, AI board Qty 1 ; Tool is not completeOEM 代工型號說明
The Applied Materials Precision 5000 CVD is a single system solution for depositing high-quality, low-temperature dielectric materials on semiconductor devices. It incorporates multi-step processes to provide enabling technology for void-free intermetal dielectric deposition with profile control. The system’s process flexibility over a wide range of applications reduces the number and types of machines required for CVD. This makes it an efficient and cost-effective solution for semiconductor manufacturing.文檔
無文檔