The Applied Materials Precision 5000 CVD is a single system solution for depositing high-quality, low-temperature dielectric materials on semiconductor devices. It incorporates multi-step processes to provide enabling technology for void-free intermetal dielectric deposition with profile control. The system’s process flexibility over a wide range of applications reduces the number and types of machines required for CVD. This makes it an efficient and cost-effective solution for semiconductor manufacturing.

Applied Materials is committed to accelerating this new PPACt playbook for our customers and partners. We have the broadest and deepest portfolio of products for delivering PPACt innovations to the market. This portfolio encompasses the ability to create and deposit, shape and remove, modify, analyze, and connect materials and devices in new ways. We are unique in having a broad suite of process technology and metrology capabilities under one roof, and we have highly differentiated silicon and packaging lab capabilities. Our Integrated Materials Solutions co-optimize materials deposition, removal, modification, and analysis to create new materials and engineer new structures for high-performance, low-power chips at leading-edge nodes.

APPLIED MATERIALS (AMAT)

P5000 CVD

VERSALINE system models are configured to perform an array of etch and deposition processes. Ion beam technology suits a range of applications, from low, controllable damage etching to high-rate, high-aspect-ratio, deep silicon etching to difficult materials. The systems support process control through EndpointWorks®. Enhancements include data logging, automated maintenance scheduler (AMS), and SECS/GEM. Our Cortex® control system provides a stable, user-friendly control interface designed for efficiency and productivity. The VERSALINE platform’s modular design allows for flexible configuration of substrate handling for a variety of handling options, from R&D single wafer or carrier loading with a loadlock to high-volume, multi-chamber production clusters. Clear upgrade paths that leverage costs and process development make future planning easy. 

Plasma-Therm is a global manufacturer of plasma etch, deposition, and advanced packaging equipment for the specialty semiconductor and nanotechnology markets.

PLASMA-THERM

VERSALINE CVD

The Watkins Johnson (WJ) WJ-1000 is an advanced chemical vapor deposition (APCVD) system specifically designed for high productivity in 200mm wafer processing lines. It offers two processing options: hybrid or TEOS-reactant processes. The system is capable of both doped and un-doped deposition of TEOS-based silicon dioxide, providing excellent flexibility for a wide range of dielectric film applications in various semiconductor manufacturing processes. 

AVIZA / WATKINS-JOHNSON

WJ-1000

The AMAT CENTURA AP ULTIMA X is a high-density plasma chemical vapor deposition (CVD) system designed for semiconductor manufacturing in both 200mm and 300mm configurations. As an industry-leading workhorse, it excels in delivering high-quality dielectric films and void-free gap fill, crucial for advanced chip fabrication. The system's dual RF coils provide superior gap-fill capability across the wafer, while its innovative electrostatic chuck ensures excellent film quality and uniformity. Combined with remote plasma clean technology, it achieves exceptional defect control and improved mean-wafer-between-clean performance. The Ultima HDP system's advanced technology enables deposition of both undoped and doped films, catering to various applications such as shallow trench isolation (STI), pre-metal dielectric (PMD), interlayer dielectric (ILD), inter-metal dielectric (IMD), and passivation. Its versatility also extends to etchback and high-density plasma treatments, enhancing film quality in semiconductor manufacturing processes.

CVD

概述

服務

CVD 的製造商

CVD 最熱門的產品

P5000 CVD

VERSALINE CVD

WJ-1000

Centura AP Ultima X