描述
Chamber MGI Electronics Wafer Transfer Systems qty 4 Leitz Secolux 6 x 6 Microscope with Nidek IM11 Autoloader Gasonics L3300 Plasma Asher 6 inch qty 2 FEI Quanta 200 Scanning Electron Microscope Four Dimensions CVMAP 3092-A Wafer CV Mapper and Mercury probe Lam Research 2080 TCU Dual Channel Chiller qty 6配置
無配置OEM 代工型號說明
The Centura TxZ is a chemical vapor deposition (CVD) system that is used for depositing thin films of various materials on semiconductor wafers. It can be used with 8” wafer size and CVD system size is also 8”. In September 1996, the Liner TxZ Centura system was launched. This system combines a new CVD TiN chamber with a Coherent PVD Ti chamber, and allows for deposition of sequential layers of Ti and CVD TiN in high-aspect-ratio metal structures under vacuum. In September 1996, the Liner TxZ Centura system was launched. This system combines a new CVD TiN chamber with a Coherent PVD Ti chamber, and allows for deposition of sequential layers of Ti and CVD TiN in high-aspect-ratio metal structures under vacuum.文檔
無文檔
類別
CVD
上次驗證: 10 天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
137235
晶圓尺寸:
未知
年份:
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
APPLIED MATERIALS (AMAT)
CENTURA TxZ
類別
CVD
上次驗證: 10 天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
137235
晶圓尺寸:
未知
年份:
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
Chamber MGI Electronics Wafer Transfer Systems qty 4 Leitz Secolux 6 x 6 Microscope with Nidek IM11 Autoloader Gasonics L3300 Plasma Asher 6 inch qty 2 FEI Quanta 200 Scanning Electron Microscope Four Dimensions CVMAP 3092-A Wafer CV Mapper and Mercury probe Lam Research 2080 TCU Dual Channel Chiller qty 6配置
無配置OEM 代工型號說明
The Centura TxZ is a chemical vapor deposition (CVD) system that is used for depositing thin films of various materials on semiconductor wafers. It can be used with 8” wafer size and CVD system size is also 8”. In September 1996, the Liner TxZ Centura system was launched. This system combines a new CVD TiN chamber with a Coherent PVD Ti chamber, and allows for deposition of sequential layers of Ti and CVD TiN in high-aspect-ratio metal structures under vacuum. In September 1996, the Liner TxZ Centura system was launched. This system combines a new CVD TiN chamber with a Coherent PVD Ti chamber, and allows for deposition of sequential layers of Ti and CVD TiN in high-aspect-ratio metal structures under vacuum.文檔
無文檔