BE Semiconductor Industries N.V. designs, develops, manufactures, markets and services die sorting, flip chip and multi-chip die bonding, packaging and plating equipment for the semiconductor industry's assembly operations.
Founded in 1968, Esec is a leading global manufacturer of die bonding equipment for the semiconductor, telecommunications and smart card industries based in Cham, Switzerland. It also manufactures and services wire bonding systems from its Singapore assembly facility.

BESI / ESEC

2005 HR

2008

2008 xP3

	The key characteristic of the power semiconductor packaging market is its need for continuous technological progress. Shrinking package sizes, cost reduction, switching power enhancements and the integration of intelligent control circuits in smart power packages are the most crucial aspects.

2007 SSI

3100

3100 plus

The ESEC 2007 SSI Plus is primarily used for die bonding, may also support flip chip bonding. It is typically designed for automation and integration into larger production lines. It can be integrated with other equipment, such as pick-and-place machines or wire bonders, to form a complete assembly solution.

2007 SSI plus

MICRON 2

BU-050-N 

2008 xP

3018

3088

2007

The Flip Chip Bonder Esec 2100 FC hS capable of running an extensive range of FC applications such as FCOL, FC‑MIS, FC‑SIP, FCCSP, FCBGA as well as emerging packages such as CSP-LED.

2100 FC

The ESEC CT-2000 series of assembly machines provides the  flexibility to perform a number of different applications based upon a standard high-performance platform. Turnkey systems includes solutions for die bonding, flip chip sorting, component transfer and final mechanical assembly.

CT-2000

The ESEC 2008hs3 Plus is a die bonder manufactured by ESEC. It is designed to handle wafers up to 300mm in size and has a bond accuracy of 25 um @ 3 sigma. This tool is capable of precisely attaching dies to substrates with a high degree of accuracy, making it a valuable tool in the semiconductor manufacturing process.

2008 hS3 plus

The Die Bonder 2100 xP from Esec achieves with its revolutionary machine layout an increase in productivity of more than 80% in relation to conventional solutions. The rotational movement utilized by the new Die Bonder 2100 xP from Esec manages four chip placements per second with a precision of 5 µm - a leading-edge achievement in robotics and an absolutely stellar performance in the industry.

2100 xP

BL 050N

The ESEC Die Bonder 2008hSplus is the successful combination of the speed and reliability of the proven high-volume 2008hS platform with the flexibility and accuracy of the award-winning high-end 2008xP platform.
The ultra fast vision system together with the enhanced Pick & Place enable production runs of 13,000 units per hour. The 2008hSplus is the ultimate epoxy die bonder with regards to handling metal lead frames, substrates, thin die, stacked die and wafer back side lamination. Of course this bonder family handle

2008 HS PLUS

3100 optima

ESEC 2007 HS is a die attacher manufactured by ESEC. Die attach, also known as die mount or die bond, is the process of attaching a silicon chip to the die pad or die cavity of the support structure (e.g., the leadframe) of a semiconductor package. There are two common die attach processes: adhesive die attach and eutectic die attach. Both of these processes use special die attach equipment and tools to mount the die.

2007 HS

The ESEC 2100 FC hS is the third generation of the highly regarded High-Speed Flip Chip platform, designed to handle a wide array of Flip Chip applications, including FCOL, FC-MIS, FC-SIP, FCCSP, FCBGA, and emerging packages like CSP-LED. This advanced bonder delivers exceptional ease of operation, providing seamless production control and assistance

2100 FC hS

2008 hS

The ESEC 2007 HS Plus is a die attacher manufactured by ESEC. Die attachers are used in the semiconductor industry to attach dies to substrates or lead frames. 

2007 HS plus

3088 iP

2008 SC3 plus

2007 IC8

The Fastest 12" Epoxy Die Bonder
The revolutionary Phi-Y pick-and-place produces a quantum leap in speed, with an increasing standard accuracy of 20 µm. Optionally, the accuracy can even be improved, down to 15 µm. minimal distances between pick and bond positions coupled with the stiff symmetrical bondhead and vibration compensation provide the shortest settling times imaginable, which ultimately lead to unsurpassed speed of the Die Bonder Esec 2100 xP plus.

2100 xP plus

Esec 2100 DS, the flexible and fast high temperature Die Bonding Platform for Leadframe Applications. The latest member of the field proven standard machine for high end production is combining the revolutionary Phi-Y pick & place and a flexible hot tunnel strip handler with forming gas or nitrogen atmosphere. The Esec 2100 DS is the most flexible and versatile Die Bonder for diffusion soldering and sintering for the time to come.

2100 DS

2007 FS plus

2006 HR

2005 HS

2005

The new Esec 2100 sD advanced i with its new Device Height Sensor and High Precision Bond Head enables unmatched process capability also including High BLT applications. Process Accuracy is further improved with the High Resolution Vision Systems, which now also includes an Up Looking System while the Dual Dispensing Module brings productivity to an unmatched level for high speed applications. The Dispense Volume Control and the Low Contrast Kit bring Process Control to a yet unseen level. Last but not least, the Esec 2100 sD advanced i introduces auto-optimizing tool offsets and dispense pressure after syringe change.

2100 sD advanced i

2008 xSC

2007 BGA

MICRON 5003

The Esec 2100 hS ix is the latest member of the 2100 i Die Bonder family. It is optimized for highest speed and scratch-free transport thanks to the easy-to-use motorized and programmable rail strip handler. The Esec 2100 hS ix also incorporates the proven features of the 2100 i generation, such as the High Resolution Vision Systems and the Dual Dispensing Module. The Esec 2100 hS ix is the new generation High Speed Die Bonder providing now the best Cost of Ownership (CoO). 

2100 hS ix

The ESEC 2009 SSIE is an advanced die bonder specifically designed to address the evolving demands of power die attach. Its exceptional productivity and precise process control set new industry standards. Utilizing patented soft solder process technologies, this die bonder ensures optimal results and helps maintain a leading market position. An outstanding feature of the ESEC 2009 SSIE is its capability to handle 300mm / 12" wafers, providing versatility and scalability for various applications.

2009 SSIE 

2007 FS

The Die Bonder Esec 2100 SC is the most flexible 300 mm high speed platform, capable of running the smart card tape. It is the most effortless system to run, assist and control production resulting in a quantum leap in throughput and yield at the lowest cost of ownership. At its introduction, this innovative platform was awarded with the prestigious Swiss Technology Award.

2100 SC

3008

The ESEC 2100 supports various bonding methods, such as eutectic solder bonding, adhesive bonding, or thermo-compression bonding, depending on the specific configuration or options chosen.  Depending on the specific model or version, the ESEC 2100 may offer additional features such as multi-die bonding, flip chip bonding, or customized configurations to meet specific customer requirements or application needs.

2100

The new Esec 2100 hSi with its new Dual Dispensing Module enables an unmatched productivity and process quality. Process Accuracy is further improved with the new High Precision Bond Head as well as the High Resolution Vision Systems, which now also includes an Up Looking System. The Dispense Volume Control and the Low Contrast Kit bring process control to a yet unseen level. Last but not least, the Esec 2100 hSi introduces auto-optimizing pick up tool offset and dispense pressure after syringe change.

2100 hSi

2006

The Die Bonder Esec 2100 hS is the 3rd generation of the most flexible 300 mm high speed platform, capable of running an extensive range of epoxy die attach applications such as QFN, TSOP, QFP, BGA, CSP-BGA, SiP-BGA, FBGA and LGA. It is the most effortless system to run, assist and control production resulting in a quantum leap in throughput and yield at the lowest cost of ownership.

2100 hS

The Esec 2009 fSE is the fastest soft solder die bonder in the industry with a broad application range. First to mention the point-to-line pick & place with stationary indexer, which enables increased throughput and productivity.

2009 fSE

2008 HL

Esec 2100 sD has a Device Height Sensor, High Precision Bond Head, High Resolution Vision Systems, which now also includes an Up Looking System while the Dual Dispensing Module brings productivity to high speed applications. The Dispense Volume Control and the Low Contrast Kit bring Process Control.

2100 sD

3006

Member of the field proven High-end Esec 2100 sD machine family is featuring the new 3rd Generation High Resolution Vision System, a completely redesigned clean unit as well as new easy to use GUI. The Esec 2100 sD advanced Die bonder is able to handle the most challenging thin die and warped strip packages. the proven "light & rigid" structure of the pick and place ensures highest accuracy and maximized throughput.

BESI / ESEC

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