概述

The new Esec 2100 sD advanced i with its new Device Height Sensor and High Precision Bond Head enables unmatched process capability also including High BLT applications. Process Accuracy is further improved with the High Resolution Vision Systems, which now also includes an Up Looking System while the Dual Dispensing Module brings productivity to an unmatched level for high speed applications. The Dispense Volume Control and the Low Contrast Kit bring Process Control to a yet unseen level. Last but not least, the Esec 2100 sD advanced i introduces auto-optimizing tool offsets and dispense pressure after syringe change. Die Bonder