概述

The new Esec 2100 hSi with its new Dual Dispensing Module enables an unmatched productivity and process quality. Process Accuracy is further improved with the new High Precision Bond Head as well as the High Resolution Vision Systems, which now also includes an Up Looking System. The Dispense Volume Control and the Low Contrast Kit bring process control to a yet unseen level. Last but not least, the Esec 2100 hSi introduces auto-optimizing pick up tool offset and dispense pressure after syringe change. Die Bonder