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2007 SSI plus
概述
The ESEC 2007 SSI Plus is primarily used for die bonding, may also support flip chip bonding. It is typically designed for automation and integration into larger production lines. It can be integrated with other equipment, such as pick-and-place machines or wire bonders, to form a complete assembly solution.
活躍中的上架商品
2
服務
檢驗、保險、評估、物流
