描述
無描述配置
無配置OEM 代工型號說明
The ESEC 2007 SSI Plus is primarily used for die bonding, may also support flip chip bonding. It is typically designed for automation and integration into larger production lines. It can be integrated with other equipment, such as pick-and-place machines or wire bonders, to form a complete assembly solution.文檔
無文檔
BESI / ESEC
2007 SSI plus
已驗證
類別
Die Bonders / Sorters / Attachers
上次驗證: 超過60天前
關鍵商品詳情
條件:
Parts Tool
作業狀態:
未知
產品編號:
101467
晶圓尺寸:
未知
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
BESI / ESEC
2007 SSI plus
類別
Die Bonders / Sorters / Attachers
上次驗證: 超過60天前
關鍵商品詳情
條件:
Parts Tool
作業狀態:
未知
產品編號:
101467
晶圓尺寸:
未知
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
無描述配置
無配置OEM 代工型號說明
The ESEC 2007 SSI Plus is primarily used for die bonding, may also support flip chip bonding. It is typically designed for automation and integration into larger production lines. It can be integrated with other equipment, such as pick-and-place machines or wire bonders, to form a complete assembly solution.文檔
無文檔