概述

The ESEC 2009 SSIE is an advanced die bonder specifically designed to address the evolving demands of power die attach. Its exceptional productivity and precise process control set new industry standards. Utilizing patented soft solder process technologies, this die bonder ensures optimal results and helps maintain a leading market position. An outstanding feature of the ESEC 2009 SSIE is its capability to handle 300mm / 12" wafers, providing versatility and scalability for various applications.