描述
Asset Description: THK28002-T - BRUKER D8 FABLINE (MT)- Software Version: 77-2.3A-6A-5A-5A-RR6A CIM: E84, SECS/GEM, GEM300 Process: XRD - Bruker配置
Hardware Configuration System Type Description Quantity Main System D* Fabline (Bruker) 1 Factory Interface FOUP 2 Others Options System LynxEye Detector for secondary side + mount 1 Options System Keyence Laser Triangulation Module 1 for Fast Height Alignment Options System Pattern Recognition Software 1 Options System Wafer Chuck 1 Handler System Standard Automation and SW 1OEM 代工型號說明
The D8 FABLINE provides fully automated handling of 300mm wafers . It provides a wide spectrum of techniques, such as rapid X-ray reflectivity (XRR), grazing incidence X-ray diffraction (GID), and high-resolution X-ray diffraction (HR-XRD) in order to facilitate advanced process development and control on strained devices and high-K thin films, as well as materials characterization for future generation technology nodes.文檔
無文檔
類別
X-Ray / XRD / XRF
上次驗證: 30 天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
136273
晶圓尺寸:
12"/300mm
年份:
2015
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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BRUKER
D8 FABLINE
類別
X-Ray / XRD / XRF
上次驗證: 30 天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
136273
晶圓尺寸:
12"/300mm
年份:
2015
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
Asset Description: THK28002-T - BRUKER D8 FABLINE (MT)- Software Version: 77-2.3A-6A-5A-5A-RR6A CIM: E84, SECS/GEM, GEM300 Process: XRD - Bruker配置
Hardware Configuration System Type Description Quantity Main System D* Fabline (Bruker) 1 Factory Interface FOUP 2 Others Options System LynxEye Detector for secondary side + mount 1 Options System Keyence Laser Triangulation Module 1 for Fast Height Alignment Options System Pattern Recognition Software 1 Options System Wafer Chuck 1 Handler System Standard Automation and SW 1OEM 代工型號說明
The D8 FABLINE provides fully automated handling of 300mm wafers . It provides a wide spectrum of techniques, such as rapid X-ray reflectivity (XRR), grazing incidence X-ray diffraction (GID), and high-resolution X-ray diffraction (HR-XRD) in order to facilitate advanced process development and control on strained devices and high-K thin films, as well as materials characterization for future generation technology nodes.文檔
無文檔