描述
8ch配置
WK_BS(Cu)OEM 代工型號說明
The Da Vinci Prime (DVP) is an advanced single-wafer wet processing platform that combines SEZ’s proven Da Vinci technology with its newest capabilities. It is designed to address the increasing overlap of BEOL and FEOL applications and the emergence of new materials. The DVP features double-sided processing, non-damage defect removal, minimized watermark formation, and multi-chemical recirculation capabilities. It targets a mix of BEOL and FEOL applications and offers key benefits such as maximized throughput, enhanced surface defect removal, and reduced media consumption.文檔
無文檔
類別
Wet Etch
上次驗證: 12 天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
144888
晶圓尺寸:
12"/300mm
年份:
2023
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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LAM RESEARCH / SEZ
DV-PRIME
類別
Wet Etch
上次驗證: 12 天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
144888
晶圓尺寸:
12"/300mm
年份:
2023
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
8ch配置
WK_BS(Cu)OEM 代工型號說明
The Da Vinci Prime (DVP) is an advanced single-wafer wet processing platform that combines SEZ’s proven Da Vinci technology with its newest capabilities. It is designed to address the increasing overlap of BEOL and FEOL applications and the emergence of new materials. The DVP features double-sided processing, non-damage defect removal, minimized watermark formation, and multi-chemical recirculation capabilities. It targets a mix of BEOL and FEOL applications and offers key benefits such as maximized throughput, enhanced surface defect removal, and reduced media consumption.文檔
無文檔