描述
無描述配置
無配置OEM 代工型號說明
The Da Vinci Prime (DVP) is an advanced single-wafer wet processing platform that combines SEZ’s proven Da Vinci technology with its newest capabilities. It is designed to address the increasing overlap of BEOL and FEOL applications and the emergence of new materials. The DVP features double-sided processing, non-damage defect removal, minimized watermark formation, and multi-chemical recirculation capabilities. It targets a mix of BEOL and FEOL applications and offers key benefits such as maximized throughput, enhanced surface defect removal, and reduced media consumption.文檔
無文檔
類別
Wet Etch
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
126411
晶圓尺寸:
未知
年份:
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
LAM RESEARCH / SEZ
DV-PRIME
類別
Wet Etch
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
126411
晶圓尺寸:
未知
年份:
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
無描述配置
無配置OEM 代工型號說明
The Da Vinci Prime (DVP) is an advanced single-wafer wet processing platform that combines SEZ’s proven Da Vinci technology with its newest capabilities. It is designed to address the increasing overlap of BEOL and FEOL applications and the emergence of new materials. The DVP features double-sided processing, non-damage defect removal, minimized watermark formation, and multi-chemical recirculation capabilities. It targets a mix of BEOL and FEOL applications and offers key benefits such as maximized throughput, enhanced surface defect removal, and reduced media consumption.文檔
無文檔