描述
1. Only the two on the right side of the 8 chambers of the entire machine can be used, while the other chambers cannot be used; 2. Only one of the four ports can be used, while the other three cannot be used; 3. Left ECO cannot be used; 4. 4 CDS, left 1 cannot be used, and the remaining 3 are normal;配置
無配置OEM 代工型號說明
The Da Vinci Prime (DVP) is an advanced single-wafer wet processing platform that combines SEZ’s proven Da Vinci technology with its newest capabilities. It is designed to address the increasing overlap of BEOL and FEOL applications and the emergence of new materials. The DVP features double-sided processing, non-damage defect removal, minimized watermark formation, and multi-chemical recirculation capabilities. It targets a mix of BEOL and FEOL applications and offers key benefits such as maximized throughput, enhanced surface defect removal, and reduced media consumption.文檔
無文檔
LAM RESEARCH / SEZ
DV-PRIME
已驗證
類別
Wet Etch
上次驗證: 21 天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
73723
晶圓尺寸:
未知
年份:
2007
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
LAM RESEARCH / SEZ
DV-PRIME
類別
Wet Etch
上次驗證: 21 天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
73723
晶圓尺寸:
未知
年份:
2007
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
1. Only the two on the right side of the 8 chambers of the entire machine can be used, while the other chambers cannot be used; 2. Only one of the four ports can be used, while the other three cannot be used; 3. Left ECO cannot be used; 4. 4 CDS, left 1 cannot be used, and the remaining 3 are normal;配置
無配置OEM 代工型號說明
The Da Vinci Prime (DVP) is an advanced single-wafer wet processing platform that combines SEZ’s proven Da Vinci technology with its newest capabilities. It is designed to address the increasing overlap of BEOL and FEOL applications and the emergence of new materials. The DVP features double-sided processing, non-damage defect removal, minimized watermark formation, and multi-chemical recirculation capabilities. It targets a mix of BEOL and FEOL applications and offers key benefits such as maximized throughput, enhanced surface defect removal, and reduced media consumption.文檔
無文檔