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描述
Okamoto gnx300 12 inch wafer back ultra-thin grinding and thinning equipment, with new color and high precision in 2005. The company has a professional service team to provide after-sales machine spare parts maintenance services.配置
無配置OEM 代工型號說明
Okamoto developed the semiconductor back-grinding machine GNX-300 for super slim 300mm (12 inches) silicon weaher.文檔
無文檔
OKAMOTO
GNX-300
類別
Wafer Grinding
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
79237
晶圓尺寸:
12"/300mm
年份:
2005
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Refurbishment Services
Available
描述
Okamoto gnx300 12 inch wafer back ultra-thin grinding and thinning equipment, with new color and high precision in 2005. The company has a professional service team to provide after-sales machine spare parts maintenance services.配置
無配置OEM 代工型號說明
Okamoto developed the semiconductor back-grinding machine GNX-300 for super slim 300mm (12 inches) silicon weaher.文檔
無文檔