OKAMOTO

GNX 200B

GNX 12PB

 Okamoto developed the semiconductor back-grinding machine GNX-300 for super slim 300mm (12 inches) silicon weaher.

GNX 300

SVG-502MKⅡ8

GNX 200

SPP 600S 

ACC-350DX

PFG-350DX

PSG-52ST

1632DX

VG 502 MKII 8

ACC-52DX

VG 502 MK II

The OKAMOTO GNX200BH is a fully automated wafer grinding machine designed for processing hard materials such as silicon carbide (SiC) and gallium nitride (GaN). It features dual grinding spindles with enhanced rigidity, a 6.7 kW spindle motor, and a three-disc worktable, enabling precise thinning and polishing of wafers.

OKAMOTO

概述

活躍中的上架商品

全部產品

服務

最熱門的 OKAMOTO Wafer Grinding

GNX 200B

GNX 12PB

SVG-502MKⅡ8

GNX 200

利用 Moov 將其上架並立即找到完美的買家。

所有 OKAMOTO Wafer Grinding