描述
Tool is complete配置
無配置OEM 代工型號說明
Okamoto developed the semiconductor back-grinding machine GNX-300 for super slim 300mm (12 inches) silicon weaher.文檔
無文檔
OKAMOTO
GNX-300
已驗證
類別
Wafer Grinding
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
93029
晶圓尺寸:
12"/300mm
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
OKAMOTO
GNX-300
類別
Wafer Grinding
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
93029
晶圓尺寸:
12"/300mm
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
Tool is complete配置
無配置OEM 代工型號說明
Okamoto developed the semiconductor back-grinding machine GNX-300 for super slim 300mm (12 inches) silicon weaher.文檔
無文檔