描述
Thinning machine配置
Back-side GrinderOEM 代工型號說明
The Disco DFG840 and 841 Systems have two-spindle, two-chuck table specifications and a robot arm. These machines feature a same-cassette return function. The robot arm vacuum ensures that even thin-ground wafers, which are prone to warping, are corrected to the required flatness for trouble-free handling.文檔
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DISCO
DFG840
類別
Wafer Grinding
上次驗證: 28 天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
136849
晶圓尺寸:
6"/150mm, 8"/200mm
年份:
1995
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
Thinning machine配置
Back-side GrinderOEM 代工型號說明
The Disco DFG840 and 841 Systems have two-spindle, two-chuck table specifications and a robot arm. These machines feature a same-cassette return function. The robot arm vacuum ensures that even thin-ground wafers, which are prone to warping, are corrected to the required flatness for trouble-free handling.文檔
無文檔