描述
DFG840 HS Grinder thinning machine配置
無配置OEM 代工型號說明
The Disco DFG840 and 841 Systems have two-spindle, two-chuck table specifications and a robot arm. These machines feature a same-cassette return function. The robot arm vacuum ensures that even thin-ground wafers, which are prone to warping, are corrected to the required flatness for trouble-free handling.文檔
無文檔
DISCO
DFG840
已驗證
類別
Wafer Grinding
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
112218
晶圓尺寸:
未知
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
類似上架商品
查看全部
DISCO
DFG840
類別
Wafer Grinding
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
112218
晶圓尺寸:
未知
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
DFG840 HS Grinder thinning machine配置
無配置OEM 代工型號說明
The Disco DFG840 and 841 Systems have two-spindle, two-chuck table specifications and a robot arm. These machines feature a same-cassette return function. The robot arm vacuum ensures that even thin-ground wafers, which are prone to warping, are corrected to the required flatness for trouble-free handling.文檔
無文檔