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DISCO DFG840
    描述
    Slicer Cutter Disco dfg840, a classic 8-inch wafer grinding equipment, can be compatible with 4-5-6-inch wafer. The equipment has good stability. The company has a professional after-sales team to provide relevant installation, commissioning and maintenance services. Rated power: ac200v, 50 / 60Hz, 17kwv Compressed air: 0.5MPa 300l/mi Grinding water: 0.2MPa 15L / min L cooling water: 0.2MPa 11L / min Weight: 2300kg
    配置
    無配置
    OEM 代工型號說明
    The Disco DFG840 and 841 Systems have two-spindle, two-chuck table specifications and a robot arm. These machines feature a same-cassette return function. The robot arm vacuum ensures that even thin-ground wafers, which are prone to warping, are corrected to the required flatness for trouble-free handling.
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    DISCO

    DFG840

    verified-listing-icon

    已驗證

    類別
    Wafer Grinding

    上次驗證: 超過60天前

    關鍵商品詳情

    條件:

    Used


    作業狀態:

    未知


    產品編號:

    79146


    晶圓尺寸:

    未知


    年份:

    未知


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    類似上架商品
    查看全部
    DISCO DFG840

    DISCO

    DFG840

    Wafer Grinding
    年份: 1995條件: 二手
    上次驗證14 天前

    DISCO

    DFG840

    verified-listing-icon
    已驗證
    類別
    Wafer Grinding
    上次驗證: 超過60天前
    listing-photo-0f396aa2fdb846a89125ca1a2f6e60b6-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1955/0f396aa2fdb846a89125ca1a2f6e60b6/3a3b2b23e7c244a7b44e9508866d35f0_dfg8401_mw.png
    listing-photo-0f396aa2fdb846a89125ca1a2f6e60b6-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1955/0f396aa2fdb846a89125ca1a2f6e60b6/ba60c7283bfc44908a69421bde45bb32_dfg8402_mw.png
    關鍵商品詳情

    條件:

    Used


    作業狀態:

    未知


    產品編號:

    79146


    晶圓尺寸:

    未知


    年份:

    未知


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    描述
    Slicer Cutter Disco dfg840, a classic 8-inch wafer grinding equipment, can be compatible with 4-5-6-inch wafer. The equipment has good stability. The company has a professional after-sales team to provide relevant installation, commissioning and maintenance services. Rated power: ac200v, 50 / 60Hz, 17kwv Compressed air: 0.5MPa 300l/mi Grinding water: 0.2MPa 15L / min L cooling water: 0.2MPa 11L / min Weight: 2300kg
    配置
    無配置
    OEM 代工型號說明
    The Disco DFG840 and 841 Systems have two-spindle, two-chuck table specifications and a robot arm. These machines feature a same-cassette return function. The robot arm vacuum ensures that even thin-ground wafers, which are prone to warping, are corrected to the required flatness for trouble-free handling.
    文檔

    無文檔

    類似上架商品
    查看全部
    DISCO DFG840

    DISCO

    DFG840

    Wafer Grinding年份: 1995條件: 二手上次驗證:14 天前
    DISCO DFG840

    DISCO

    DFG840

    Wafer Grinding年份: 0條件: 二手上次驗證:超過60天前
    DISCO DFG840

    DISCO

    DFG840

    Wafer Grinding年份: 0條件: 二手上次驗證:超過60天前