描述
Slicer Cutter Disco dfg840, a classic 8-inch wafer grinding equipment, can be compatible with 4-5-6-inch wafer. The equipment has good stability. The company has a professional after-sales team to provide relevant installation, commissioning and maintenance services. Rated power: ac200v, 50 / 60Hz, 17kwv Compressed air: 0.5MPa 300l/mi Grinding water: 0.2MPa 15L / min L cooling water: 0.2MPa 11L / min Weight: 2300kg配置
無配置OEM 代工型號說明
The Disco DFG840 and 841 Systems have two-spindle, two-chuck table specifications and a robot arm. These machines feature a same-cassette return function. The robot arm vacuum ensures that even thin-ground wafers, which are prone to warping, are corrected to the required flatness for trouble-free handling.文檔
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DISCO
DFG840
已驗證
類別
Wafer Grinding
上次驗證: 21 天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
79146
晶圓尺寸:
未知
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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DISCO
DFG840
類別
Wafer Grinding
上次驗證: 21 天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
79146
晶圓尺寸:
未知
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
Slicer Cutter Disco dfg840, a classic 8-inch wafer grinding equipment, can be compatible with 4-5-6-inch wafer. The equipment has good stability. The company has a professional after-sales team to provide relevant installation, commissioning and maintenance services. Rated power: ac200v, 50 / 60Hz, 17kwv Compressed air: 0.5MPa 300l/mi Grinding water: 0.2MPa 15L / min L cooling water: 0.2MPa 11L / min Weight: 2300kg配置
無配置OEM 代工型號說明
The Disco DFG840 and 841 Systems have two-spindle, two-chuck table specifications and a robot arm. These machines feature a same-cassette return function. The robot arm vacuum ensures that even thin-ground wafers, which are prone to warping, are corrected to the required flatness for trouble-free handling.文檔
無文檔