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DISCO DFG840
    描述
    long (cm): 152, Width (cm): 122, High (cm): 142, Weight( KG): 300
    配置
    Thinning machine (used)
    OEM 代工型號說明
    The Disco DFG840 and 841 Systems have two-spindle, two-chuck table specifications and a robot arm. These machines feature a same-cassette return function. The robot arm vacuum ensures that even thin-ground wafers, which are prone to warping, are corrected to the required flatness for trouble-free handling.
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    已驗證

    類別
    Wafer Grinding

    上次驗證: 28 天前

    關鍵商品詳情

    條件:

    Used


    作業狀態:

    未知


    產品編號:

    151103


    晶圓尺寸:

    未知


    年份:

    未知


    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    類似上架商品
    查看全部
    DISCO DFG840

    DISCO

    DFG840

    Wafer Grinding
    年份: 0條件: 二手
    上次驗證28 天前

    DISCO

    DFG840

    verified-listing-icon
    已驗證
    類別
    Wafer Grinding
    上次驗證: 28 天前
    listing-photo-455f6d8ce4374d6d9b7242be0f40e097-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
    關鍵商品詳情

    條件:

    Used


    作業狀態:

    未知


    產品編號:

    151103


    晶圓尺寸:

    未知


    年份:

    未知


    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    描述
    long (cm): 152, Width (cm): 122, High (cm): 142, Weight( KG): 300
    配置
    Thinning machine (used)
    OEM 代工型號說明
    The Disco DFG840 and 841 Systems have two-spindle, two-chuck table specifications and a robot arm. These machines feature a same-cassette return function. The robot arm vacuum ensures that even thin-ground wafers, which are prone to warping, are corrected to the required flatness for trouble-free handling.
    文檔

    無文檔

    類似上架商品
    查看全部
    DISCO DFG840

    DISCO

    DFG840

    Wafer Grinding年份: 0條件: 二手上次驗證:28 天前
    DISCO DFG840

    DISCO

    DFG840

    Wafer Grinding年份: 0條件: 二手上次驗證:28 天前
    DISCO DFG840

    DISCO

    DFG840

    Wafer Grinding年份: 0條件: 二手上次驗證:28 天前