跳到主要內容
6" Fab For Sale from Moov - Click Here to Learn More
6" Fab For Sale from Moov - Click Here to Learn More
Moov logo

6" Fab For Sale from Moov - Click Here to Learn More
Moov Icon
EVGroup (EVG) GEMINI
    描述
    無描述
    配置
    無配置
    OEM 代工型號說明
    A maximum level of automation and process integration is achieved with the GEMINI automated production wafer bonding system. Wafer-to-wafer alignment and wafer bonding processes up to 200 mm (300 mm) for volume manufacturing are all performed in one fully automated platform. Device manufacturers benefit from increased production output, a high integration level and a wide choice of bonding process methods like anodic, silicon fusion, thermo-compression and eutectic bonding.
    文檔

    無文檔

    EVGroup (EVG)

    GEMINI

    verified-listing-icon

    已驗證

    類別
    Wafer Bonders

    上次驗證: 超過60天前

    關鍵商品詳情

    條件:

    Used


    作業狀態:

    未知


    產品編號:

    57199


    晶圓尺寸:

    未知


    年份:

    未知


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    類似上架商品
    查看全部
    EVGroup (EVG) GEMINI

    EVGroup (EVG)

    GEMINI

    Wafer Bonders
    年份: 2012條件: 二手
    上次驗證超過60天前

    EVGroup (EVG)

    GEMINI

    verified-listing-icon
    已驗證
    類別
    Wafer Bonders
    上次驗證: 超過60天前
    listing-photo-f20e9a4acea24cbe950c6bb884d561f9-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
    關鍵商品詳情

    條件:

    Used


    作業狀態:

    未知


    產品編號:

    57199


    晶圓尺寸:

    未知


    年份:

    未知


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    描述
    無描述
    配置
    無配置
    OEM 代工型號說明
    A maximum level of automation and process integration is achieved with the GEMINI automated production wafer bonding system. Wafer-to-wafer alignment and wafer bonding processes up to 200 mm (300 mm) for volume manufacturing are all performed in one fully automated platform. Device manufacturers benefit from increased production output, a high integration level and a wide choice of bonding process methods like anodic, silicon fusion, thermo-compression and eutectic bonding.
    文檔

    無文檔

    類似上架商品
    查看全部
    EVGroup (EVG) GEMINI

    EVGroup (EVG)

    GEMINI

    Wafer Bonders年份: 2012條件: 二手上次驗證:超過60天前
    EVGroup (EVG) GEMINI

    EVGroup (EVG)

    GEMINI

    Wafer Bonders年份: 0條件: 二手上次驗證:超過60天前
    EVGroup (EVG) GEMINI

    EVGroup (EVG)

    GEMINI

    Wafer Bonders年份: 0條件: 二手上次驗證:超過60天前