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EVGroup (EVG) GEMINI
    描述
    無描述
    配置
    無配置
    OEM 代工型號說明
    A maximum level of automation and process integration is achieved with the GEMINI automated production wafer bonding system. Wafer-to-wafer alignment and wafer bonding processes up to 200 mm (300 mm) for volume manufacturing are all performed in one fully automated platform. Device manufacturers benefit from increased production output, a high integration level and a wide choice of bonding process methods like anodic, silicon fusion, thermo-compression and eutectic bonding.
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    EVGroup (EVG)

    GEMINI

    verified-listing-icon

    已驗證

    類別
    Wafer Bonders

    上次驗證: 超過60天前

    關鍵商品詳情

    條件:

    Used


    作業狀態:

    未知


    產品編號:

    36142


    晶圓尺寸:

    8"/200mm


    年份:

    2012


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    類似上架商品
    查看全部
    EVGroup (EVG) GEMINI

    EVGroup (EVG)

    GEMINI

    Wafer Bonders
    年份: 2012條件: 二手
    上次驗證超過60天前

    EVGroup (EVG)

    GEMINI

    verified-listing-icon
    已驗證
    類別
    Wafer Bonders
    上次驗證: 超過60天前
    listing-photo-9b1ebff43d584f299d18e732a65dfac5-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1689/36142/b806c04f491346659ad84e82bdcc5e23_4eedb568b6514ea39ca282418264401aimage259_mw.jpeg
    listing-photo-9b1ebff43d584f299d18e732a65dfac5-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1689/36142/c453c4d233f942f0b0a1b2f3d2e6a087_ec105ad81a044d9a974631608822436cimage259_mw.jpeg
    listing-photo-9b1ebff43d584f299d18e732a65dfac5-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1689/36142/cc364d914e1148bd86ac50f3b434c09e_b9ba89e1e3744b9cafb3db27c72c37a1image260_mw.jpeg
    listing-photo-9b1ebff43d584f299d18e732a65dfac5-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1689/36142/30db7a27b7b54b67afa5e332cf2f06df_e747c7ac409141a68028b9273c1e4c45image260_mw.jpeg
    listing-photo-9b1ebff43d584f299d18e732a65dfac5-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1689/36142/74d5747244554be6bc3927d39a9287a7_83576107be9445ad8c0f4522cd6d008aimage261_mw.jpeg
    listing-photo-9b1ebff43d584f299d18e732a65dfac5-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1689/36142/f93c9c9441a54089a18f2227e0f84f69_e955cc0cfbf54823aab91142c9be6addimage261_mw.jpeg
    關鍵商品詳情

    條件:

    Used


    作業狀態:

    未知


    產品編號:

    36142


    晶圓尺寸:

    8"/200mm


    年份:

    2012


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    描述
    無描述
    配置
    無配置
    OEM 代工型號說明
    A maximum level of automation and process integration is achieved with the GEMINI automated production wafer bonding system. Wafer-to-wafer alignment and wafer bonding processes up to 200 mm (300 mm) for volume manufacturing are all performed in one fully automated platform. Device manufacturers benefit from increased production output, a high integration level and a wide choice of bonding process methods like anodic, silicon fusion, thermo-compression and eutectic bonding.
    文檔

    無文檔

    類似上架商品
    查看全部
    EVGroup (EVG) GEMINI

    EVGroup (EVG)

    GEMINI

    Wafer Bonders年份: 2012條件: 二手上次驗證:超過60天前
    EVGroup (EVG) GEMINI

    EVGroup (EVG)

    GEMINI

    Wafer Bonders年份: 0條件: 二手上次驗證:超過60天前
    EVGroup (EVG) GEMINI

    EVGroup (EVG)

    GEMINI

    Wafer Bonders年份: 0條件: 二手上次驗證:超過60天前