EV Group (EVG) is a leading supplier of high-volume production equipment and process solutions for the manufacture of semiconductors, MEMS, compound semiconductors, power devices and nanotechnology devices.
A recognized market and technology leader in wafer-level bonding and lithography for advanced packaging and nanotechnology, EVG’s key products include wafer bonding, thin-wafer processing and lithography/nanoimprint lithography (NIL) equipment, photoresist coaters, as well as cleaning and inspection/metrology systems.

EVG850 TB XT Frame is an automated bonding system
Wafer Bonder


EVGroup (EVG)

EVG850 TB XT Frame

The EVG GEMINI FB XT is an advanced fusion bonding system designed for high-precision applications. It excels in memory stacking, 3D systems on chip (SoC), backside illuminated CMOS image sensor stacking, and die partitioning. The system incorporates the SmartView NT3 bond aligner, specifically developed for fusion and hybrid wafer bonding alignment with an impressive accuracy of less than 50 nm. It supports wafer diameters of 200mm and 300mm, offering a blend of productivity, alignment, and overlay precision.

Wafer Bonder

GEMINI FB XT

Automated production bonding system for a wide range of fusion/molecular wafer bonding applications
Wafer bonding is one key enabling technology for the SOI wafer fabrication process as well as for wafer-level 3D integration and advanced packaging. With the EVG850 LT automated production bonding system for mechanically aligned SOI and direct wafer bonding with LowTemp™ plasma activation, all essential steps for fusion bonding – from cleaning, plasma activation and alignment to pre-bonding and IR-inspection – are combined. Thus, the field-proven, industry-standard EVG850 LT assures a high-throughput, high-yield production process for void-free SOI wafers up to 300 mm sizes.

Wafer Bonder

 EVG850 LT

The EVG610 bond alignment system is designed for wafer-to-wafer alignment up to 200 mm wafer sizes. EV Group's bond alignment systems offer a manual high-precision alignment stage with bottom-side microscope. The precision of EVG's bond alignment system accommodates the most demanding alignment processes in MEMS production and in emerging fields like 3D integration applications.

Wafer Bonder

EVG610 BA

High-vacuum wafer bonding platform facilitating covalent bonds of “anything on anything”.

Wafer Bonder

COMBOND

The EVG520 HE is a cutting-edge semi-automated hot embossing system, specifically tailored for high-precision thermoplastic substrate imprinting. Capable of accommodating substrates up to 200 mm in diameter, it seamlessly integrates with industry-standard semiconductor manufacturing technologies. The system features high-vacuum and high-contact force capabilities, along with a universal embossing chamber, ensuring efficient and reliable processing. Its versatility allows for working with a comprehensive range of polymers suitable for hot embossing applications, making it an ideal choice for advanced manufacturing needs. 

Wafer Bonder

EVG520 HE

The EVG320 D2W is a highly flexible platform that features a universal hardware/software interface to enable seamless integration with third-party pick-and-place die bonding systems. It also can operate as a stand-alone system depending on integration and line balancing requirements. The system incorporates EVG’s advanced cleaning and plasma activation technology, which is available across its industry-standard W2W fusion and hybrid bonding platforms and has been proven in hundreds of installed modules worldwide. In addition, the EVG320 D2W features EVG’s alignment verification module (AVM), an integrated metrology module that provides direct feedback to the die bonder on critical process parameters, such as die placement accuracy and die-height information as well as post-bond metrology, for improved process control. It also features flexible substrate handling that can accommodate any type of die carrier or film frame that can support plasma activation, hybrid and fusion bonding cleanliness standards, and SECS/GEM standard support.

 EVG320 D2W

EVG850 TBL is an automated temporary bonding system with integrated lamination system up to 300mm.

Wafer Bonder

EVG850 TBL

EV 501S

EVG850 DB XT Frame is an automated debonding system up to 300 mm.

EVG850 DB XT Frame

EVG510 HE is a semi-automated hot embossing system up to 200mm

Wafer Bonder

EVG510 HE

The SmartView NT automated bond alignment system for universal alignment offers a proprietary method for micron-level face-to-face wafer-level alignment. This alignment technique is key to achieving the required accuracy in multiple wafer stacks for leading-edge technologies. SmartView technology can be combined with the GEMINI wafer bonding systems for subsequent permanent bonding in a fully automated platform.

Wafer Bonder

SMARTVIEW NT

The EVG560 automated wafer bonding system accepts up to four bond chambers with various bond chamber configuration options for all bonding processes and wafers up to 300 mm. Based on the same bond chamber design and incorporating the key features of EVG's manual bonding systems with enhanced process control and automation, the EVG560 bonder delivers high-yield production bonds. A robot handling system automatically loads and unloads the process chambers.

EVG560

EVG®540 Automated Chip-to-Wafer Bonding System
Single chamber production bonder up to 300 mm. Dedicated for chip-to-wafer and wafer-to-wafer bond processes. Unique compliant layer system to compensate chips thickness variations.

EVG540 C2W

Known for its high level of automation and reliability, the EVG620 bond alignment system is designed for wafer-to-wafer alignment up to 150 mm wafer sizes. EV Group´s bond alignment systems offer the highest precision, flexibility and ease of use, and modular upgrade capability, and have been qualified in numerous high-throughput production environments. The precision of EVG´s bond alignment system accommodates the most demanding alignment processes in MEMS production and in emerging fields like 3D integration applications.

Wafer Bonder

 EVG620 BA

The EVG540 automated wafer bonding system is an automated single-chamber production bonder designed for pilot-line manufacturing as well as R&D for high-volume manufacturing in wafer-level packaging, 3D-interconnect and MEMS applications. Based on a modular design, the EVG540 provides a proven solution for future transition of wafer bonding processes from R&D to large-scale manufacturing on our fully integrated production bonding systems.

 EVG540

A maximum level of automation and process integration is achieved with the GEMINI automated production wafer bonding system. Wafer-to-wafer alignment and wafer bonding processes up to 200 mm (300 mm) for volume manufacturing are all performed in one fully automated platform. Device manufacturers benefit from increased production output, a high integration level and a wide choice of bonding process methods like anodic, silicon fusion, thermo-compression and eutectic bonding.

GEMINI

EVG520

Automated production bonding system for a wide range of fusion/molecular wafer bonding applications
SOI wafers are a promising new basic material for the microelectronics industry to produce faster and higher-performance microelectronic devices. Wafer bonding, as one key enabling technology for the SOI wafer fabrication process, achieves high-quality single-crystal silicon films on insulating substrates. With the EVG850 SOI production bonding system, all essential steps for SOI bonding – from cleaning and alignment to pre-bonding and IR-inspection – are combined. Thus, the EVG850 assures a high-yield production process for void-free SOI wafers up to 300 mm sizes. Being the only production system built to operate in high-throughput, high-yield environments, the EVG850 has been established as the industry standard in the SOI wafer market.

 EVG850

The EVG®510 is a semi-automated wafer bonding system that is versatile and quick to adapt. It can accommodate various substrate sizes, ranging from pieces to 200 mm. It is compatible with all standard wafer bonding processes, including anodic, glass frit, solder, eutectic, transient liquid phase, and direct. Its design allows for swift retooling for different wafer sizes and processes, with a conversion time of less than 5 minutes.

Wafer Bonder

EVG510

The EVG520-IS is a semi-automated wafer bonding system developed by EV Group (EVG). It is designed to handle wafers up to 200 mm in size, making it suitable for small-volume-production applications. The system's design has been improved based on customer feedback and EV Group's continuous technological innovations. One of its key features is the proprietary symmetric rapid heating and cooling chuck design, which ensures efficient and precise bonding processes. The EVG520-IS offers independent top- and bottom-side heaters, enabling high-pressure bonding capability and providing excellent material and process flexibility. 

 EVG520IS

The EVG501 is a versatile and flexible wafer bonding system, capable of handling substrate sizes ranging from single chips to 150 mm (200 mm with a 200 mm bond chamber). It supports various wafer bonding processes, including anodic, glass frit, solder, eutectic, transient liquid phase, and direct bonding. The system's design allows for easy access to the bond chamber and tooling, enabling quick and straightforward retooling for different wafer sizes and processes. With a conversion time of less than 5 minutes, the EVG501 offers efficient and seamless transitions between different bonding applications, making it an ideal solution for diverse wafer bonding needs.

EVG501

The fully automated temporary bonding system achieves the whole temporary bonding process – starting with temporary adhesive application, baking, alignment and bonding of the device wafer to the carrier wafer – within one automated tool. The equipment layout is modular as with all of EVG’s fully automated tools, meaning it can be throughput-optimized depending on the specific process. The optional inline metrology module allows total process monitoring and parameter optimization with feedback loops. Because of EVG’s open platform, different types of temporary bonding adhesives can be used, such as spin coat thermoplast, thermoset materials, or tapes.

Wafer Bonder

EVG850 TB

Substrate / Wafer parameters: 
50 – 150 mm
150 – 200 mm 
200 – 300 mm

Wafer Bonder

SMARTVIEW

EV501

GEMINI FB Automated Production Wafer Bonding System
Wafer sizes up to 300 mm 

GEMINI FB (Fusion Bond) performs aligned direct bonding at room temperature and ambient pressure conditions. Because the initial bond is formed when the wafers are brought into contact in the aligner, there is no need for bond chambers.  High throughput, best alignment accuracy and small footprint, combined with multiple pre-processing chambers, ensures best performance.

GEMINI FB 


The EVG TBM-8 is a tool designed for non-destructive, double-sided overlay accuracy measurement. It can measure any substrate material up to 8" and is not reliant on infrared. It’s applicable in micro system technology, sensors, micro optics, hybrid technology, multilayers, and any other technology involving critical double-sided lithography.

6" Fab For Sale from Moov - Click Here to Learn More

6" Fab For Sale from Moov - Click Here to Learn More

6" Fab For Sale from Moov - Click Here to Learn More

EVGroup (EVG)

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SMARTVIEW NT

EVG540 C2W

EVG560

EVG620 BA

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