描述
FULLY AUTOMATIC LASER SAW DFL7340 are for Sapphire 6inch in same process配置
無配置OEM 代工型號說明
The DFL7341 is a fully automatic laser saw for Φ8-inch wafers which has seen wide use in applications such as LED sapphire substrates and silicon microphones. It uses a Stealth Dicing™ process that makes it possible for brittle materials such as SiC and GaN to be singulated without chipping.文檔
無文檔
DISCO
DFL7340
已驗證
類別
Scribing, Cutting, Dicing
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
69249
晶圓尺寸:
6"/150mm
年份:
2010
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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DISCO
DFL7340
類別
Scribing, Cutting, Dicing
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
69249
晶圓尺寸:
6"/150mm
年份:
2010
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
FULLY AUTOMATIC LASER SAW DFL7340 are for Sapphire 6inch in same process配置
無配置OEM 代工型號說明
The DFL7341 is a fully automatic laser saw for Φ8-inch wafers which has seen wide use in applications such as LED sapphire substrates and silicon microphones. It uses a Stealth Dicing™ process that makes it possible for brittle materials such as SiC and GaN to be singulated without chipping.文檔
無文檔