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描述
Dicing HDD X配置
SawOEM 代工型號說明
The DFL7341 is a fully automatic laser saw for Φ8-inch wafers which has seen wide use in applications such as LED sapphire substrates and silicon microphones. It uses a Stealth Dicing™ process that makes it possible for brittle materials such as SiC and GaN to be singulated without chipping.文檔
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DISCO
DFL7340
類別
Scribing, Cutting, Dicing
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
112378
晶圓尺寸:
4"/100mm
年份:
2012
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描述
Dicing HDD X配置
SawOEM 代工型號說明
The DFL7341 is a fully automatic laser saw for Φ8-inch wafers which has seen wide use in applications such as LED sapphire substrates and silicon microphones. It uses a Stealth Dicing™ process that makes it possible for brittle materials such as SiC and GaN to be singulated without chipping.文檔
無文檔