DISCO develops, manufactures, and sells precision machines and precision processing tools.

The Disco DAD3350 is an automatic dicing saw that supports a wide range of applications. It is capable of handling a maximum of Φ8-inch or 250 x 250 mm workpieces (user-specified specification). A 1.8 kW spindle is equipped as standard. By selecting a 2.2 kW high-torque spindle (optional), it is possible to process silicon up to difficult-to-process materials, such as ceramic.

DISCO

DAD3350

The DAD321 is an automatic dicing/cutting saw made by Disco Corporation. It is capable of handling wafers up to 6 inches in diameter and features an automatic theta rotation system. The unit is only 500mm wide and has a new 1.5kW SynchroSpindle that helps improve product quality.

DAD321

DFD651

The DFL7160 is a fully automatic laser saw that is compatible with 300 mm wafers. It uses a pulse laser to achieve non-thermal processing and supports various applications, including full cut and DAF cut. This model has seen wide use in many applications such as GaAs full cut and DAF cut after DBG. To prevent wafer contamination from laser processing particles, the DFL7160 can be equipped with the HogoMax coating/cleaning mechanism, which is a water-soluble protective film that prevents laser processing particles from adhering to the wafer surface. This makes the DFL7160 a versatile and reliable tool for wafer processing.

DFL7160

The Disco DFD6361 is a Fully Automatic Dicing Saw. It offers highly consistent and dependable cut quality through the new Synchro Spindle featuring superior radial rigidity. The DFD6361 enhances throughput in two distinct ways: DISCO’s facing dual design and a reduction in distance between the blades help to control total cut time, while high-magnification microscopes (standard) and non-contact setup sensors (option) for both Z1 and Z2 reduce the time required for non-dicing sequences, such as kerf check and blade setup.

DFD6361

The DFL7341 is a fully automatic laser saw for Φ8-inch wafers which has seen wide use in applications such as LED sapphire substrates and silicon microphones. It uses a Stealth Dicing™ process that makes it possible for brittle materials such as SiC and GaN to be singulated without chipping.

DFL7340

The Disco DFD6340 is a Fully Automatic Dicing Saw that features a facing dual-spindle configuration with a shorter distance between blades, which improves throughput by up to 30% for step/bevel cut and 40% for dual cut when compared with parallel dual spindle dicing saws. It has the smallest footprint of any 8" saw in its class and utilizes an adjustable LCD touch screen graphical user interface making operation and maintenance intuitive and easy.

DFD6340

The Disco DFD641 has a maximum workpiece size of an ø8" wafer and is equipped with a 1.0 kW Synchro Spindle air bearing spindle. It can accommodate a maximum blade size of 61 mm and has a single spindle configuration. It also features enhanced productivity with automatic alignment and is suitable for semiconductor device applications.

DFD641

The DFD6360 workpiece has a maximum diameter of ø304.8 mm (ø12"). The air bearing spindle is a 1.0 kW Synchro Spindle and the maximum blade size is 61 mm. The spindle configuration is facing dual-spindles. The process method includes dual cut and step and bevel cut, which effectively reduces front and backside chipping and improves die strength. The graphical user interface allows for intuitive operation. This is suitable for applications such as semiconductor devices, ceramics, and glass.

DFD6360

Disco DAD341 dicing saw can accommodate 200mm wafers and features an automatic theta rotation system. In addition to the new 1.0kW *Synchro SpindleTM, a new 2.2kW *Synchro SpindleTM is available as an option, widening the range of applications by raising the unit's ability to handle large workpieces and hard-to-cut materials.

DAD341

The DFD6362 is a fully automatic dicing saw made by Disco Corporation. It is designed for improved productivity with Φ300 mm wafers and has a facing dual spindle. It offers higher dual cut processing speed due to the shortened distance between the spindles and various new functions.

DFD6362

EAD6340

Realizes a throughput improvement of approx 15% compared to the DAD321. Improved machine responsiveness with the latest CPU board. Also, improve feed speed of the spindle axis by refining the axis mechanism. Equipped with an auto alignment function, which has an established reputation in higher ranking models. Also, it employs a GUI to make screen operation easy. 14% smaller footprint compared to the DAD321.

DAD322

DFD641 has a maximum workpiece size of an ø8” wafer and features a 1.0 kW Synchro Spindle air bearing spindle. It can accommodate a maximum blade size of 61 mm and has a single spindle configuration. DFD641 also offers enhanced productivity through automatic alignment and is suitable for applications involving semiconductor devices."

DAD641

DFD640

DFD650

DAD640

Discontinued Apr. 1997
Up to 8inches wafer

DAD340

DAD691

The DAD320 is an automatic dicing saw developed in 1992.

DAD320

DAD-2H/6

Simple and Compact Manual Dicing Saw Compatible with Φ8-inch Workpieces

High processability
Adoption of a 1.8 kW high-output spindle enables the processing of a wide range of materials from silicon to difficult-to-process materials like ceramics.

High maintainability
Built-in microscope with a lens shutter and scope blow function reduces maintenance frequency, which increases the utilization rate.

DAD3240

The 600 Series automatic dicing saws perform package singulation with custom jigs matched perfectly to the package substrate. The substrate is held in place by a vacuum, eliminating tape costs. After singulation, substrate waste is efficiently and effectively ejected from the dicer. Workpiece placement on the chuck table is manual, but alignment is automatic. An optional mechanical spindle supports multi-blade processing for higher throughput. The DAD695 has a max workpiece size of 250x250 and a maximum stroke of 30mm for the 1.0 kW air spindle and 40mm for the 2.2kW mechanical spindle.

DAD695

Disco DFD681 can handle a workpiece size of up to ø8” wafer and has a 2.2 kW Synchro SpindleTM air bearing spindle. The maximum blade size is 76.2 mm and it has a single spindle configuration. It also has enhanced productivity with automatic alignment and can be used for applications such as cutting Quartz, glass, ceramics, Lithium Niobate, Lithium Tantalate and other hard-to-cut materials.

DFD681

DAD522

The DFD6341 is a fully automatic dual spindle dicing saw for Φ8-inch wafers made by DISCO Corporation. It incorporates throughput enhancement technology developed in DFD6362 for Φ300 mm wafers and has a uniquely developed axis mechanism that enables X-axis return speeds up to 1,000 mm/s.

DFD6341

The DFD6240 is a Fully Automatic Dicing Saw developed by DISCO Corporation. It is among the world’s smallest single spindle dicing saws with a Φ200 mm Single spindle. The equipment is designed to reduce energy and air consumption, contributing to lower operation costs and environmental impact. It offers highly consistent and dependable cut quality through the new Synchro Spindle™ for superior radial rigidity.

DFD6240

2009
Introducing the DAD3650, the world's smallest dual-spindle automatic dicing saw.

Ultra compact dual-spindle automatic dicing saw

Small footprint
The optimal design of the DAD3650 combines high functionality and ultra compactness for a dual-spindle automatic dicing saw giving it a footprint 2/3 the size of the widely used single-spindle DAD3350 dicer for Φ8 inch wafers

DAD3650

2014
Developed the DAD323, the world’s smallest footprint automatic dicing saw with expanded functionality.

World’s Smallest* Dicing Saw which Supports Diversified Processing from Semiconductor Wafers to Electric Components

Diversified Processes
The DAD323 is a single-axis dicing saw with a 2.0 kW high-torque spindle, compatible with workpieces as large as 6 x 6 inches. Adopting the Y-axis scale specification (optional) allows for high-precision index control and processing of difficult-to-process materials, including glass and ceramics. In addition, DAD323 is a versatile model and can be equipped with a 1.8 kW high-rotation spindle (highest rotation speed: 60,000 min-1) as an option.

DAD323

This dual dicer uses 1.0kW Synchro Spindles arranged in parallel to improve quality in step cutting and bevel cutting applications on workpieces up to ø203.2 mm (ø8") in diameter. It can handle a maximum blade size of 61 mm and is suitable for use on semiconductors, ceramics, and glass. The dual cut and step cut & bevel cut process methods effectively reduce front and backside chipping and improve die strength.

DAD651

EAD6361

EAD6750

DAD381

DAD681

Disco’s laser application lineup supports miniaturized next generation devices. Providing the optimum ”Kiru” technology for various materials. Disco DFL7020 is a compact fully-automatic Model for sapphire processing.

DFL7020

The DAD3220 is an automatic dicing saw designed for compactness and compatible with 6 × 6-inch workpieces using a user-specified specification. It has a Φ150 mm single spindle and features an LCD touch panel with a graphical user interface for easy and intuitive operation.

DAD3220

DAD-2H/6T

DAD562

The DFL7560L is a fully-automatic laser lift-off machine for Φ6-inch wafers which achieves high processing speed and high processing quality using a DPSS (solid state) laser. It is manufactured by Disco Corporation. The maximum workpiece size is Φ300 mm and the processing range of the X-axis (Chuck table) is Φ310 mm with a moving speed of 1 ～ 600 mm/s.

DFL7560L

The DAD3231 is an Evolved Compact Dicing Saw designed by Disco Corporation for high performance and expandability. It has a Φ150 mm Single spindle and can satisfy a wide range of needs, including electronic component materials such as glasses and ceramics. The equipment layout was designed with additional space, so it can support workpieces up to 6 x 6 inches as an option.

DAD3231

2004
6"-compatible automatic dicing saw DAD3220/3230/3430 and 8"-compatible fully automatic dicing saw DFD6450 developed.

Compatible with 6 x 6-inch Workpieces Using a User-Specified Specification
Single-axis dicing saw which is compatible with the 6 x 6-inch workpiece using a user-specified specification

Improved usability and performance
Each model features an LCD touch panel with a graphical user interface for easy and intuitive operation. In addition, all models include auto-alignment, auto-focus, and auto-kerf check functions for enhanced productivity. The newly developed 1.5 kW spindle, which is standard on every model, features a shaft lock function for easier blade changing. A reduced-expansion spindle (option) manufactured with special expansion-resistant materials is available for even greater precision during processing.

DAD3430

DFD660

DFD-2S/8

DAD521

The Disco DFD6750 is a Fully Automatic Dicing Saw that provides significantly raised productivity. It incorporates two chuck tables to enable one table to perform cutting while the other is simultaneously transferring, aligning, and cleaning. This results in a substantial reduction in spindle processing wait time for higher productivity.

DFD6750

Highly expandability to support various processing needs
Φ200 mm         Single spindle

Supports a wide range of applications
DAD3351 is a semi automatic dicing saw compatible with Φ8-inch workpieces. Includes a high output 1.8 kW spindle as standard. Also, using a high torque, high rigidity 2.2 kW spindle (optional), difficult-to-process materials including silicon and ceramics can be processed. Through a user-specified specification, blades up to Φ5 inches can be used for processing. As a result, it is possible to process workpieces with thicknesses of 10 mm or more. Supports blades up to Φ5 inches with user-specified specification. In addition, the multi-alignment function is available as an option.

DAD3351

2017
Developed DFD6562, a small-footprint, fully automatic dicing saw that supports Φ300 mm wafers.

A space-saving solution for Φ300 mm dicing

16% reduced footprint
DFD6560 is equipped with uniquely developed short spindles and an optimized bridge-type frame structure resulting in a 16% reduced footprint. All maintenance can be performed from the front of the equipment, thus reducing the area needed for installation and maintenance areas by 20% (compared to the DFD6362). The DFD6560 is particularly ideal when installing multiple adjacent units.

DFD6560

Adopted an air slide on the X-axis to support high precision processing needs
Φ150 mm          Single spindle


DAD3431

The Disco Corporation DAD3230 Automatic Dicing Saw is a compact dicing saw for Φ6-inch workpieces with superior expandability. It is compatible with 6 x 6-inch workpieces using a user-specified specification. It has a cutting range of 160/220 mm (optional accessory) on the X-axis and 162 mm on the Y-axis. The maximum stroke on the Z-axis is 32.2 mm (with Φ2 inch blades). The maximum rotating angle of the θ-axis is 320 degrees. The spindle has a rated output of 1.5 kW and a rated torque of 0.48 N・m.

DAD3230

Φ6-inch Compact Dicing Saw which Achieves World’s Smallest Footprint while Improving Functionality

Support for a variety of applications from semiconductor wafers to electronic parts
DAD324 is a single-axis dicing saw which is compatible with workpieces up to Φ6 inches with a 2.0 kW high-torque spindle. 150 x 150 mm workpieces can be processed using a user-specified specification.

DAD324

The Disco DAD3360 Automatic Dicing Saw is a Φ300 mm manual dicer that can meet a variety of needs. It offers exceptional processing flexibility while having an even more compact footprint than the existing DAD3350. Workpieces of sizes up to Φ300 mm are now supported and a high output 1.8 kW spindle is available as a standard option. The DAD3360 can cut not only silicon wafers but also products of a variety of sizes and materials such as large package substrates and electronic parts including SAW filters.

DAD3360

Two high-speed (max. 60,000rpm), ultralow-vibration air spindles are provided. DISCO’s original blade know-how and ultralow-vibration, high-speed spindles work together to achieve high-quality dicing at high speed, for not only silicon wafers but also compound semiconductor
wafers.
The dual spindle configuration ensures improved throughput via dual dicing and enhanced quality via step and bevel cutting. 

DFD-2D/8

DAD-2SP/6T

DAC551	

1987
DFD-3D/8 dual-spindle dicing saw developed.

DFD-3D/8

DAD560

DAD650

Ultra-compact Dual Spindle Dicing Saw Which Achieves Increased Processing Stability
Φ200 mm            Facing dual spindle


DAD3651

Highly expandability to support various processing needs
Φ300 mm        Single spindle

Supports a wide range of applications
DAD3361 is a semi-automatic dicing saw capable of handling Φ300 mm workpieces.* A high-output 1.8 kW spindle is equipped as standard. By selecting a 2.2 kW high-torque, high-rigidity spindle (optional), it is possible to process silicon up to difficult-to-process materials, such as ceramic. Support for blades of up to Φ5 inches is possible with user-specified specifications. In addition, the alignment function for multiple-mounting workpieces to one table frame can be added an option.

* Supports jig tables with Φ395 mm or smaller circumscribed circles (user-specified specification).

DAD3361

2015
Developed the DAD3660, a dual spindle automatic dicing saw with support for workpieces as large as 360 mm x 360 mm.

Dual spindle automatic dicing saw for large packaging substrates
Φ300 mm            Facing dual spindle              Package Singulation


DAD3660

1992
DFD620 and DFD640 fully automatic dicing saws developed.

DFD620

DAD6450

The Disco DFD691 has a maximum workpiece handling size of an ø8" wafer and is equipped with a 2.2 kW Synchro Spindle air bearing spindle. It can accommodate a maximum blade size of 76.2 mm and has a parallel dual-spindle configuration. The machine also features enhanced productivity with automatic alignment and is suitable for semiconductor, ceramic, and glass applications. It offers process methods such as dual cut and step cut & bevel cut, which effectively reduces front and backside chipping and improves die strength.

DFD691

The Disco-DFL7361 is a laser saw developed by Disco Corporation. It uses a processing method called Stealth Dicing, which focuses a laser within the workpiece to form a modified layer. Die separation is achieved with a tape expander. This method controls cutting waste because only a subsurface layer is processed, making it suitable for workpieces that are vulnerable to contamination.

DFL7361

Standard manual dicing saw for Φ8-inch workpieces 

High productivity
Improved throughput through the introduction of servo motors on all axes (X, Y, and Z).
The index accuracy has been improved by installing a Y-axis scale as a standard specification. In addition, DAD3241 includes software function enhancement, communication control through PC electric component installation, measurement accuracy improvement, and measurement time reduction using the high-speed, high-accuracy NCS (Non-Contact Setup).

DAD3241

The Disco DAD3221 is an automatic dicing saw that is compatible with diverse small workpiece processing needs. It is a single-axis dicing saw which achieves processing of workpieces up to Φ6 inches as a standard, and 150 x 150 mm with a user-specified specification. It has the world’s smallest footprint (width: 490 mm x depth: 870 mm) through the small footprint design.

DAD3221

DAD561

Dual spindle automatic dicing saw for large packaging substrates
Φ300 mm              Facing dual spindle                  Package Singulation


DAD3661

2016
Developed DFD6310, a panel level packaging compatible dicing saw.

DFD6310

Achieves high productivity for sapphire, lithium tantalate, and MEMS processing
Φ200 mm        Stealth Dicing™         SDBG         SDTT

DFL7341 is a fully automatic laser saw for Φ8-inch wafers which has seen wide used in applications such as LED sapphire substrates and silicon microphones.
Stealth Dicing™ process makes it possible for brittle materials such as SiC and GaN to be singulated without chipping.
This is a completely dry process, making it suitable for processing devices such as MEMS that are susceptible to water damage.

DFL7341

2000
New series dicing saws, DFD6350 and DFD6360, and new series grinder, DFG8540, developed.

DFD6350

Fully automatic dicing saw with parallel dual spindles
Φ200 mm
Parallel dual spindle
Package Singulation

DFD6450

The DFL7360FH is a laser saw from Disco Corporation. It is a dedicated tape frame transfer model that realizes high productivity for sapphire and MEMS processing and supports a variety of processes1. It uses Stealth Dicing, a processing method that focuses a laser within the workpiece to form a modified layer. Die separation is achieved with a tape expander2. This method controls cutting waste because only a subsurface layer is processed, making it suitable for workpieces that are vulnerable to contamination. It is also a dry process that does not require cleaning, suitable for applications (such as MEMS) that are vulnerable to mechanical load.

DFL7360FH

DAD-2H/8

The Disco DFD6561 Fully Automatic Dicing Saw is a space-saving solution for Φ300 mm dicing. It is equipped with uniquely developed short spindles and an optimized bridge-type frame structure resulting in a 16% reduced footprint. All maintenance can be performed from the front of the equipment, thus reducing the area needed for installation and maintenance areas by 20% (compared to the DFD6362).

DFD6561

The EAD685 is a jig-mounted dicing engine from DISCO that is combined with an OEM customer’s handler to produce a CSP Singulation System. The dicing engine is equipped with special CSP software containing various alignment methods. The system offers advanced precision technology, excellent process performance, and a superior cutting finish. It also features automatic alignment and workpiece handling, ease of operation and maintenance, and minimized cost of ownership. The system is designed and constructed with superior quality components for reliability.

EAD685

Fully automatic dicing saw with dual chuck tables
DFD6760 is a high end model which has further enhanced productivity from the existing model, DFD6362. Since this dicing saw has two chuck tables (hereafter called C/T), it is possible for transfer and alignment to occur on one chuck table, while processing is performed on the other chuck table. This shortens the spindle waiting time for processing considerably and improves productivity. In addition, inspection and measurement operations including processed workpiece image recording and workpiece thickness measurement using an NSD* can be performed on one chuck table, while processing proceeds on the other chuck table to maintain throughput. Increased X, Y and Z-axis feed speeds (same as the existing model) also contribute to the reduced processing time.

* Non-contact Surface Detector （option）

DFD6760

2017
Developed DFD6562, a small-footprint, fully automatic dicing saw that supports Φ300 mm wafers.

DFD6562

DAC-2SPH

a laser saw which supports the KABRA processing of Φ8-inch wafers

DAL7440

DFD670

DFD690

DAD-3S/8

The EAD695 is a jig-mounted dicing engine from DISCO that, when combined with an OEM customer’s handler, produces a CSP Singulation System. The engine is equipped with special CSP software containing various alignment methods. It offers advanced precision technology, excellent process performance, and a superior cutting finish. The system also boasts automatic alignment and workpiece handling, ease of operation and maintenance, and minimized cost of ownership. Its superior design and construction, as well as the use of quality components, ensure reliability.

EAD695

DAD-2H/6M

DAC350

DAC770

Discontinued 	Nov. 1996
up to 12 in wafer

DAD380

DAD680

DAC-2SP/6

DFD-2HST

The DFL7161 is a fully automatic laser saw for Φ300 mm wafers. It has a maximum processing range of 310 mm on both the X and Y axes and can move at speeds between 1 and 1,000 mm/s on the X-axis. The Z-axis has a moving resolution of 0.000015 mm and a repeatability accuracy of 0.002 mm. The θ-axis (Chuck table) has a maximum rotating angle of 330 degrees (standard) or 380 degrees (option). The equipment dimensions are 1,560 × 1,550 × 1,800 mm (W×D×H) and it weighs approximately 2,300 kg.

DFL7161

DAC750

DAD-3D/8

DAD690

DAC-4SPI/126

2017
Developed DFL7362, a stealth dicing laser saw that achieves higher throughput.

Laser saw compatible with various processes which achieves high-speed, high-quality processing of ultra-thin Si
Φ300 mm        Stealth Dicing™       SDBG       SDTT

DFL7362 is a fully-automatic laser saw for Φ300 mm wafers used mainly to singulate ultra-thin Si wafers.
Si with a thickness of 50 µm or less can be singulated at high speed while maintaining high die strength.
The equipment offers both wafer and frame transferring, making it possible to support a wide range of applications.

DFL7362

DAD685

Φ6-inch ingot support laser saw for KABRA process

DAL7420

1975
Automatic Scriber/Dicing Saw DAD-2H developed and acclaimed a hit when exhibited at SEMICON West.

Discontinued 	Jan. 1978

DISCO

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