概述

This dual dicer uses 1.0kW Synchro Spindles arranged in parallel to improve quality in step cutting and bevel cutting applications on workpieces up to ø203.2 mm (ø8") in diameter. It can handle a maximum blade size of 61 mm and is suitable for use on semiconductors, ceramics, and glass. The dual cut and step cut & bevel cut process methods effectively reduce front and backside chipping and improve die strength.