概述

The Disco DFD691 has a maximum workpiece handling size of an ø8" wafer and is equipped with a 2.2 kW Synchro Spindle air bearing spindle. It can accommodate a maximum blade size of 76.2 mm and has a parallel dual-spindle configuration. The machine also features enhanced productivity with automatic alignment and is suitable for semiconductor, ceramic, and glass applications. It offers process methods such as dual cut and step cut & bevel cut, which effectively reduces front and backside chipping and improves die strength.