描述
Laser Dicing Saw配置
無配置OEM 代工型號說明
The DFL7341 is a fully automatic laser saw for Φ8-inch wafers which has seen wide use in applications such as LED sapphire substrates and silicon microphones. It uses a Stealth Dicing™ process that makes it possible for brittle materials such as SiC and GaN to be singulated without chipping.文檔
無文檔
DISCO
DFL7340
已驗證
類別
Scribing, Cutting, Dicing
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
96645
晶圓尺寸:
6"/150mm
年份:
2011
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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DISCO
DFL7340
已驗證
類別
Scribing, Cutting, Dicing
上次驗證: 超過30天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
96645
晶圓尺寸:
6"/150mm
年份:
2011
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
Laser Dicing Saw配置
無配置OEM 代工型號說明
The DFL7341 is a fully automatic laser saw for Φ8-inch wafers which has seen wide use in applications such as LED sapphire substrates and silicon microphones. It uses a Stealth Dicing™ process that makes it possible for brittle materials such as SiC and GaN to be singulated without chipping.文檔
無文檔