描述
DC magnetron Sputter, RF Diode Sputter, RF magnetron Sputter 1-4 of cathode. Perkin-Elmer 4400 Sputtering Deposition Equipment Delta Cathode Perkin-Elmer 4400 Sputtering Deposition Equipment Delta Cathode small sample to 6 inch wafer 1-2 gas lines with MFC RF Etch Bias function Loadlock heating function Chamber heating function (Occupy one cathode port). Co-Sputter function Reactive sputter function配置
無配置OEM 代工型號說明
The Perkin-Elmer 4400 Series is a fast cycle, water-cooled load locked system that uses circular or delta style cathodes. It has the advantage of eliminating the need to vent the process chamber for loading and unloading substrates, reducing pump down time, contamination, and target burn-in. This increases material utilization. The system is a general-purpose sputtering system with up to four 8 inch diameter circular cathodes that can use DC Magnetron, RF Magnetron, or RF Diode configurations. These can be sputtered sequentially without breaking vacuum. Power sources are available up to 2 kW RF and 5 kW DC.文檔
無文檔
類別
PVD / Sputtering
上次驗證: 20 天前
關鍵商品詳情
條件:
Refurbished
作業狀態:
未知
產品編號:
138433
晶圓尺寸:
未知
年份:
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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PERKIN ELMER
4400
類別
PVD / Sputtering
上次驗證: 20 天前
關鍵商品詳情
條件:
Refurbished
作業狀態:
未知
產品編號:
138433
晶圓尺寸:
未知
年份:
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
DC magnetron Sputter, RF Diode Sputter, RF magnetron Sputter 1-4 of cathode. Perkin-Elmer 4400 Sputtering Deposition Equipment Delta Cathode Perkin-Elmer 4400 Sputtering Deposition Equipment Delta Cathode small sample to 6 inch wafer 1-2 gas lines with MFC RF Etch Bias function Loadlock heating function Chamber heating function (Occupy one cathode port). Co-Sputter function Reactive sputter function配置
無配置OEM 代工型號說明
The Perkin-Elmer 4400 Series is a fast cycle, water-cooled load locked system that uses circular or delta style cathodes. It has the advantage of eliminating the need to vent the process chamber for loading and unloading substrates, reducing pump down time, contamination, and target burn-in. This increases material utilization. The system is a general-purpose sputtering system with up to four 8 inch diameter circular cathodes that can use DC Magnetron, RF Magnetron, or RF Diode configurations. These can be sputtered sequentially without breaking vacuum. Power sources are available up to 2 kW RF and 5 kW DC.文檔
無文檔