描述
無描述配置
-Cryo pump on chamber -Load lock turbo, QDP-80 dry pump -2 ch. Auto gas control -2kw RF / 5KW DC -Comes with 4 RF diode / 8 in round targets (2 silicon) -Chamber heat option - digital target & substrate bias meters -RF deposition, etch mode, bias mode, and split power. (T1 & T3) -Power dist box (on top of load lock) -Rough pump & backing pump includedOEM 代工型號說明
The Perkin-Elmer 4400 Series is a fast cycle, water-cooled load locked system that uses circular or delta style cathodes. It has the advantage of eliminating the need to vent the process chamber for loading and unloading substrates, reducing pump down time, contamination, and target burn-in. This increases material utilization. The system is a general-purpose sputtering system with up to four 8 inch diameter circular cathodes that can use DC Magnetron, RF Magnetron, or RF Diode configurations. These can be sputtered sequentially without breaking vacuum. Power sources are available up to 2 kW RF and 5 kW DC.文檔
無文檔
PERKIN ELMER
4400
已驗證
類別
PVD / Sputtering
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
67776
晶圓尺寸:
未知
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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PERKIN ELMER
4400
類別
PVD / Sputtering
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
67776
晶圓尺寸:
未知
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
無描述配置
-Cryo pump on chamber -Load lock turbo, QDP-80 dry pump -2 ch. Auto gas control -2kw RF / 5KW DC -Comes with 4 RF diode / 8 in round targets (2 silicon) -Chamber heat option - digital target & substrate bias meters -RF deposition, etch mode, bias mode, and split power. (T1 & T3) -Power dist box (on top of load lock) -Rough pump & backing pump includedOEM 代工型號說明
The Perkin-Elmer 4400 Series is a fast cycle, water-cooled load locked system that uses circular or delta style cathodes. It has the advantage of eliminating the need to vent the process chamber for loading and unloading substrates, reducing pump down time, contamination, and target burn-in. This increases material utilization. The system is a general-purpose sputtering system with up to four 8 inch diameter circular cathodes that can use DC Magnetron, RF Magnetron, or RF Diode configurations. These can be sputtered sequentially without breaking vacuum. Power sources are available up to 2 kW RF and 5 kW DC.文檔
無文檔