描述
無描述配置
3 Magnetron Sputtering Cathodes up to 10KW (T1 MRC Planar DC/RF, T2 MRC Inset DC, T3 MRC Inset DC) 1 AE MDX Power Supply 10 KW 1 Cryo Pump CTI 8 Installed in Process Chamber (NO Cryo in LL) 1 Cryo Compressor CTI 8200 1 Etch Station (Hard Etch 13,56 Mhz, ENI ACG-10B) 1 Heat Station in Etch Position Real Time Controller PLC Mitsubishi Windows PC for User InterfaceOEM 代工型號說明
The MRC 603 is a sputter system designed to deposit thin film metals by DC source. It can hold four 6-inch wafers on a pallet for the process. The tool can be used to deposit aluminum (Al), titanium (Ti), and indium-tin-oxide (ITO) for single or multi-stack films like an Al/Ti文檔
無文檔
KDF / MRC
603
類別
PVD / Sputtering
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
128787
晶圓尺寸:
未知
年份:
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
無描述配置
3 Magnetron Sputtering Cathodes up to 10KW (T1 MRC Planar DC/RF, T2 MRC Inset DC, T3 MRC Inset DC) 1 AE MDX Power Supply 10 KW 1 Cryo Pump CTI 8 Installed in Process Chamber (NO Cryo in LL) 1 Cryo Compressor CTI 8200 1 Etch Station (Hard Etch 13,56 Mhz, ENI ACG-10B) 1 Heat Station in Etch Position Real Time Controller PLC Mitsubishi Windows PC for User InterfaceOEM 代工型號說明
The MRC 603 is a sputter system designed to deposit thin film metals by DC source. It can hold four 6-inch wafers on a pallet for the process. The tool can be used to deposit aluminum (Al), titanium (Ti), and indium-tin-oxide (ITO) for single or multi-stack films like an Al/Ti文檔
無文檔