The MRC 603 is a sputter system designed to deposit thin film metals by DC source. It can hold four 6-inch wafers on a pallet for the process. The tool can be used to deposit aluminum (Al), titanium (Ti), and indium-tin-oxide (ITO) for single or multi-stack films like an Al/Ti

KDF / MRC 

Load-locks for high throughput and come with a choice of two (Axis II), three (Axis III) and four (Axis IV) target configurations.



8671

654IX

903M

8667

603B-3

974i

902ix

PLANAR

603NT

603A-4

Large area, four-target, RF / DC batch-sputtering system, designed for processing high-density interconnect, 200mm semiconductor wafers and flat panel displays.

744i

902M

904i

The 903i is targeted at contact metallurgy processing because of its pure metal target deposition and convenient wafer to pallet loading abilities, for sputter down applications. The base 903i with its rough pumped load lock allows users to achieve fast production exchange cycles.

903i

8800

654 NTX

903A

924 PVD

902A

643P

The MRC 693 is a sputtering system of the TES-600 Fast Cycle Load Lock variety that has undergone a complete rebuild by Technical Engineering Services (TES). It boasts updated software, a flat screen monitor from Planar, a Pinnacle II DC Power Supply from Advanced Energy, and control software and hardware from GE Fanuc System Automation. Additionally, it comes equipped with an RF Power Supply and a Matching Network.

 744NT

8671 / 3A

844i

Galaxy 1000 cluster tool, Flow-Enhanced CVD, W, TiN processes for integrated W plug formation (combined with adhesion layer PVD and aluminum PVD).

GALAXY 1000

The 603i is typically used for sensitive applications that utilize target material that produces unusually high particulate contamination. The base 603i with its rough pumped load lock allows users to achieve fast production exchange cycles. The 603i is typically used in telecommunications manufacturing, chip resistor and resistor network applications, along with a host of other manufacturing processes.

KDF / MRC

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