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配置

SYSTEM DESCRIPTIONS: DEPOSITION CHAMBER: • Chamber and control cabinet mounted to integral frame • 304L stainless steel chamber, 14” wide x 18” tall. o 100 mm Ø substrate size capability o Three magnetron capability (up to 3” target diameter). • One set of internal chamber deposition shields included. DEPOSITION CHAMBER PUMPING: • 620 l/s Turbo pump and controller. • Edwards XDS10 dry scroll pump • High vacuum, 3 position gate valve. VACUUM GAUGING AND PROCESS GAS CONTROL: • (1) Full range (Piranhi/Bayard-Alpert) gauge transmitter. • Ceramic capacitance manometer .1 torr FS • (2) Mass flow controllers with MKS controller. (Ar and N2) SPUTTER SOURCES: • (3) 2.0" diameter, internal "stalk-mount" • (3) Flex type, planar magnetron sputter sources. o (1) Direct cooled for Ti • (3) independent, electro-pneumatic cathode shutters. SPUTTER POWER SUPPLIES: • (1) Solid State DC power supply 1kW. • (1) Solid State RF power supply 300 watt. • (1) DC switch A/B select. SUBSTRATE STAGE: RF BIAS • DVI RF Bias 100 mm substrate stage assembly. • (1) Solid State RF power supply 300 watt. • 0-20 RPM. SYSTEM CONTROL AND AUTOMATION: • Color touch panel control and graphical status display • Multimode capabilities include: AUTOPUMP: automatic load-lock and chamber pumpdown to high vacuum conditions AUTOVENT: automatic load-lock and chamber venting to atmospheric pressure MANUAL: front panel operation of all pumps, valves, and installed subsystems AUTOMATIC: automatic operation of user-defined process sequences MAINTENANCE MODE software-switch selectable from MANUAL mode; permits all MANUAL MODE functionality with “soft” system valve interlocks disabled and “hard” safety interlocks operational