AJA is a manufacturer of thin film deposition systems including magnetron sputtering, e-beam evaporation, thermal evaporation, and ion milling systems.

ATC 1800 UHV. (5) con-focal A320-XP 2" UHV sputter sources with in-situ tilt, (1) normal incidence A330-XP-3” UHV sputtering source for high rate applications, CTI-8 cryopump, 850°C rotating substrate heater with RF bias, computer control & load-lock for 100 mm Ø substrates.

AJA INTERNATIONAL, INC

ATC 1800 UHV

ATC 2200 UHV. (6) A330-XP 3" UHV sputter sources with in-situ tilt, 1200 l/s turbopump, 800°C, rotating substrate heater with RF bias, computer control and automated (9) substrate cassette elevator in the load-lock for 150 mm Ø substrates.

ATC 2200 UHV

ATC-B-2436. For CD mastering, this system handles one rotating substrate at a time and employs a  single AJA Nautilus Series Rotating magnetron for optimum uniformity.

ATC-B-2436

ATC-B-2848. Small in-line coater designed to utilize AJA STXL rectangular magnetrons to coat multiple substrates on a moving pallet. The pictured system was used to make large quantities of 1mm x 5xmm, temperature sensitive Platinum on ceramic sensors for use in thermostats.

ATC-B-2848

ATC-Orion 5 UHV with Load-Lock. Fitted with up to (5) 2" UHV magnetron sputter sources.

ATC-ORION 5 UHV

ATC 1800 T UHV. Accommodates up to (4) Radak Furnaces and a 4cm K&R gridded ion source for pre-cleaning and ion assisted thermal deposition.  The sources include individual QCM isolation tubes to allow controlled co-deposition and an 850°C substrate heater.

ATC 1800 T UHV

ATC-Orion 8 HV. Fitted with up to (5) 3" or (8) 2" HV magnetron sputter sources. This unit features a HiPIMS power supply.

ATC-ORION 8 HV 

ATC-Orion 8 UHV. Fitted with up to (5) 3" or (8) 2" UHV  magnetron sputtering sources.  This unit features a turbo-pumped vacuum load lock with 6 position cassette.

ATC-Orion 8 HV 
Fitted with up to (5) 3" or (8) 2" HV magnetron sputter sources. This unit features a HiPIMS power supply.

ATC-ORION 8 UHV

ATC-B-3400-H. Extended process side sputtering batch coater designed for a proprietary application requiring 40-50 thousand layers per run.  Custom AJA STXL-EO (extended operation) magnetrons were designed to prevent aborted processing due to source shorting.  This system will process (8) 6" substrates or hundreds of smaller substrates per batch.

ATC-B-3400-H

AJA INTERNATIONAL, INC’s ATC 1800 is a versatile PVD coating tool that can be built in a variety of configurations to satisfy most requirements. It is part of the ATC Flagship Series Sputtering Systems and is built around AJA’s unique A300-XP (UHV) or Stiletto Series (HV) magnetron sputtering sources which feature in-situ source head tilting allowing precise and repeatable con-focal, direct, and off-axis thin film deposition. The ATC 1800 can be built in a variety of configurations to satisfy most requirements. For example, it can be fitted with (5) 2" magnetrons with in-situ tilt. These versatile sputtering systems can also be fitted with other deposition sources (e-beam evaporation, thermal evaporation and PLD), ion sources, facing target sputtering sources (FTS), contact masking systems, metal-sealed tops, bake jackets, glove boxes, cassettes, auto-loading and analytical tools (RHEED, XPS, Auger, RGA, Ellipsometers and MOS).

ATC 1800-V

ATC-B-3400. Mask making tool processes (6) 8" wafers per batch with up to (3) materials deposited from AJA TR5313 triangular magnetrons for optimum uniformity. The system also includes a 7 substrate cassette in the load-lock to boost throughput up to (60) 8" substrates (or thousands of small substrates) per 8 hour period.

ATC-B-3400

ATC 2600 UHV. (12) Source direct sputter coater for (8) 1" samples.  Sample positioning is stepper motor controlled and programmable.

ATC 2600 UHV

For coating substrates up to 300mm in diameter, this system accommodates up to (4) 4” sputtering sources simultaneously using (2) sources at different angles to uniformly coat 300mm  Ø area. This tool also includes a broad beam End Hall ion source for substrate pre-clean and sample preparation.

ATC-H-2020

ATC 1500-F

ATC 2200-V: 22" diameter x 17" deep (Standard Chamber Size)

ATC 2200-V

ATC 2200-UHV-DMD. The bake jacketed UHV system above is configured to coat up to (4) 4" diameter, 1" thick Ge substrates per batch from both sides by utilizing an in-situ substrate pallet flipping mechanism. 

ATC 2200-UHV-DMD

ATC-E SERIES E-BEAM EVAPORATION SYSTEMS.
ATC-2030-E. A box coater with multi pocket rotary e-beam source and dual thermal sources. This model was fitted with a (4) x 4" wafer flat planetary substrate holder.

ATC-2030-E

ATC 2200-H Horizontal Sputter Coater. Capable of coating concave, 25 mm thick, X-ray mirror substrates up to 300 mm in diameter with +/- 2% uniformity utilizing (4) in-situ tilt sputter guns.  The substrate carrier can also be replaced by planetary tooling for a batch of 3D objects or small wafers or coupons.

AJA INTERNATIONAL, INC

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ATC 2200-V

ATC-B-3400

ATC 1800-V

ST20

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