描述
無描述配置
無配置OEM 代工型號說明
The WDF DP is a unique device that offers the dual functionality of a wafer prober and a dicing frame handler. It is specifically designed for CSP/WLCSPs, one of the fastest growing markets in recent years. The WDF DP can handle both regular wafers and wafers/substrates on dicing frames, resulting in production efficiency improvement. Additionally, the WDF DP helps reduce testing costs because of its change-over-kit less solution and higher index time as compared with a conventional handler. Some of its key features include wafer and dicing frame handling capability without use of a change-over-kit, over twice the throughput of conventional horizontally moving handler, special alignment available for diced wafers, hot temperature testing (max : 150℃), and flat-top for the large test-head. Overall, the WDF DP is an innovative solution that can help improve production efficiency and reduce testing costs.文檔
無文檔
TEL / TOKYO ELECTRON
WDF DP
已驗證
類別
Probers
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
11898
晶圓尺寸:
8"/200mm
年份:
2006
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
TEL / TOKYO ELECTRON
WDF DP
類別
Probers
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
11898
晶圓尺寸:
8"/200mm
年份:
2006
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
無描述配置
無配置OEM 代工型號說明
The WDF DP is a unique device that offers the dual functionality of a wafer prober and a dicing frame handler. It is specifically designed for CSP/WLCSPs, one of the fastest growing markets in recent years. The WDF DP can handle both regular wafers and wafers/substrates on dicing frames, resulting in production efficiency improvement. Additionally, the WDF DP helps reduce testing costs because of its change-over-kit less solution and higher index time as compared with a conventional handler. Some of its key features include wafer and dicing frame handling capability without use of a change-over-kit, over twice the throughput of conventional horizontally moving handler, special alignment available for diced wafers, hot temperature testing (max : 150℃), and flat-top for the large test-head. Overall, the WDF DP is an innovative solution that can help improve production efficiency and reduce testing costs.文檔
無文檔