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TEL / TOKYO ELECTRON PRECIO NANO
    描述
    Docked Teradyne Tester IP750EP, J750EX SACC (cart move type) Hot Chuck (Nickel) Needle Cleaning Unit (150mm x 150mm) GPIB interface Temperature range : based on the configuration. (Hot only)
    配置
    無配置
    OEM 代工型號說明
    Precio nano™ is a 300mm wafer prober that realizes high accuracy contact and cleanness under high load. In the probing process, demand for probing technology has diversified as process miniaturization, high function/high integration devices and packages are changing.
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    verified-listing-icon

    已驗證

    類別
    Probers

    上次驗證: 14 天前

    關鍵商品詳情

    條件:

    Used


    作業狀態:

    未知


    產品編號:

    137149


    晶圓尺寸:

    12"/300mm


    年份:

    2011


    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
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    年份: 2015條件: 二手
    上次驗證14 天前

    TEL / TOKYO ELECTRON

    PRECIO NANO

    verified-listing-icon
    已驗證
    類別
    Probers
    上次驗證: 14 天前
    listing-photo-30bfa0580c134d0fbf11f0636228e691-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1158/30bfa0580c134d0fbf11f0636228e691/f3b42849106d4ca8bd206e414bc82061_cb1fbf7f28e54916a233fbb9be57800d1201a_mw.jpeg
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    listing-photo-30bfa0580c134d0fbf11f0636228e691-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1158/30bfa0580c134d0fbf11f0636228e691/c8fd360dea90473ea7f09dbc903cc26f_telprecionanopv0002820230116005_mw.jpg
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    關鍵商品詳情

    條件:

    Used


    作業狀態:

    未知


    產品編號:

    137149


    晶圓尺寸:

    12"/300mm


    年份:

    2011


    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    描述
    Docked Teradyne Tester IP750EP, J750EX SACC (cart move type) Hot Chuck (Nickel) Needle Cleaning Unit (150mm x 150mm) GPIB interface Temperature range : based on the configuration. (Hot only)
    配置
    無配置
    OEM 代工型號說明
    Precio nano™ is a 300mm wafer prober that realizes high accuracy contact and cleanness under high load. In the probing process, demand for probing technology has diversified as process miniaturization, high function/high integration devices and packages are changing.
    文檔

    無文檔

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