We value your privacy
We and our selected partners use cookies to enhance your browsing experience, serve personalized content, and analyze our traffic. By clicking "Accept All", you consent to our use of cookies. 閱讀詳情
描述
Prober配置
無配置OEM 代工型號說明
The P-12XLn+ is a next-generation wafer prober developed for 300mm testing. It retains the acclaimed on-axis alignment feature of previous models while being able to handle reduced pad sizes. The system assures high-accuracy probing under both high and low temperature conditions, thanks to its hot and cold temperature, heat dissipation thermal systems. Additionally, the P-12XLn+'s rigid deflection-resistant stage can handle higher pin counts with lower mechanical deflection. The P-12XLn+ also features an automation system and equipment standardization, as well as clean technology, PC-aided product file management, and remote operation. It is capable of handling CIM/FA, such as AMHS, and is software compatible with the P-8 series probers. The P-12XLn+ is capable of measuring wafer sizes of 300mm, 200mm, and 150mm (option). TEL has also introduced the P12XLm, an improved model of the P-12XLn+, with superior alignment capability.文檔
無文檔
類別
Probers
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
89795
晶圓尺寸:
12"/300mm
年份:
2005
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
類似上架商品
查看全部
TEL / TOKYO ELECTRON
P-12XLn+
類別
Probers
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
89795
晶圓尺寸:
12"/300mm
年份:
2005
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
Prober配置
無配置OEM 代工型號說明
The P-12XLn+ is a next-generation wafer prober developed for 300mm testing. It retains the acclaimed on-axis alignment feature of previous models while being able to handle reduced pad sizes. The system assures high-accuracy probing under both high and low temperature conditions, thanks to its hot and cold temperature, heat dissipation thermal systems. Additionally, the P-12XLn+'s rigid deflection-resistant stage can handle higher pin counts with lower mechanical deflection. The P-12XLn+ also features an automation system and equipment standardization, as well as clean technology, PC-aided product file management, and remote operation. It is capable of handling CIM/FA, such as AMHS, and is software compatible with the P-8 series probers. The P-12XLn+ is capable of measuring wafer sizes of 300mm, 200mm, and 150mm (option). TEL has also introduced the P12XLm, an improved model of the P-12XLn+, with superior alignment capability.文檔
無文檔