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APPLIED MATERIALS (AMAT) EMAX CT+ CHAMBER
    描述
    無描述
    配置
    Turbo pump: Alcatel ATH 1600M Bias RF (13.5 MHz) LF Bias RF (2 MHz):Daihen RMN-50N1 (amat p/n : 0190-15322) Source RF (60 MHz): Daihen AMN-30H (amat p/n : 0190-15323) Gate valve: Nor-Cal / NC-95-PP 13.56 MHz: ENI GHW-50A (amat p/n : 0190-15319) 2 MHz: ENI B-5002 (amat p/n : 0190-15320) 60 HHz: AE Ovation 2760 (amat p/n : 0190-17779) FIB: eFib, wFib (Facilities Interface Box) Chamber Equip Cart: amat p/n : 0010-24353
    OEM 代工型號說明
    Well-established in logic, memory, and foundry fabs worldwide, eMAX provides this extensive installed base with extendibility of a proven chamber.For next generation applications, optional hardware refinements (dual-zone gas feed, multiple RF frequencies, and enhanced pumping capability) produce higher etch rates, improved uniformity, and tighter profile control while eliminating wafer-edge effects. To balance selectivity versus etch capability, especially for high aspect ratio etch, eMAX operates in a low pressure/high gas flow regime complemented by process chemistries specifically tailored to optimize resist and baselayer selectivities.Rapid wafer handling, high etch rates, and four-chamber capabilities translate into high productivity. Effective polymer deposition management through temperature controls and plasma confinement facilitates extended production runs. Longer mean time between cleans (>150 RF hours), high system throughput, 90%+ up time, and low consumables costs combine to create a production-proven, reliable, cost-effective etch system.
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    APPLIED MATERIALS (AMAT)

    EMAX CT+ CHAMBER

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    已驗證

    類別

    Plasma Etch
    上次驗證: 超過60天前
    關鍵商品詳情

    條件:

    Used


    作業狀態:

    未知


    產品編號:

    28757


    晶圓尺寸:

    8"/200mm


    年份:

    2007

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    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    類似上架商品
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    APPLIED MATERIALS (AMAT) EMAX CT+ CHAMBER
    APPLIED MATERIALS (AMAT)EMAX CT+ CHAMBERPlasma Etch
    年份: 2007條件: 二手
    上次驗證超過60天前

    APPLIED MATERIALS (AMAT)

    EMAX CT+ CHAMBER

    verified-listing-icon

    已驗證

    類別

    Plasma Etch
    上次驗證: 超過60天前
    listing-photo-362d323901f94817adad8906a4b31f6d-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1182/362d323901f94817adad8906a4b31f6d/6d5c5a9975184ed0ad09015fd6d85fdf_3209f6ea27d540dbbd7ba89f845a612545005c_f.jpeg
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    關鍵商品詳情

    條件:

    Used


    作業狀態:

    未知


    產品編號:

    28757


    晶圓尺寸:

    8"/200mm


    年份:

    2007


    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    描述
    無描述
    配置
    Turbo pump: Alcatel ATH 1600M Bias RF (13.5 MHz) LF Bias RF (2 MHz):Daihen RMN-50N1 (amat p/n : 0190-15322) Source RF (60 MHz): Daihen AMN-30H (amat p/n : 0190-15323) Gate valve: Nor-Cal / NC-95-PP 13.56 MHz: ENI GHW-50A (amat p/n : 0190-15319) 2 MHz: ENI B-5002 (amat p/n : 0190-15320) 60 HHz: AE Ovation 2760 (amat p/n : 0190-17779) FIB: eFib, wFib (Facilities Interface Box) Chamber Equip Cart: amat p/n : 0010-24353
    OEM 代工型號說明
    Well-established in logic, memory, and foundry fabs worldwide, eMAX provides this extensive installed base with extendibility of a proven chamber.For next generation applications, optional hardware refinements (dual-zone gas feed, multiple RF frequencies, and enhanced pumping capability) produce higher etch rates, improved uniformity, and tighter profile control while eliminating wafer-edge effects. To balance selectivity versus etch capability, especially for high aspect ratio etch, eMAX operates in a low pressure/high gas flow regime complemented by process chemistries specifically tailored to optimize resist and baselayer selectivities.Rapid wafer handling, high etch rates, and four-chamber capabilities translate into high productivity. Effective polymer deposition management through temperature controls and plasma confinement facilitates extended production runs. Longer mean time between cleans (>150 RF hours), high system throughput, 90%+ up time, and low consumables costs combine to create a production-proven, reliable, cost-effective etch system.
    文檔

    無文檔

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