描述
無描述配置
Turbo Pump: Alcatel ATH 1600M Bias: 13.5 MHz/ Daihen RMN-50M2 (P/n: 1090-10906) Throttle Valve Assy: VAT (P/N: 0010-4145) 13.56 MHz: ENI GHW-25A FIB: eFIB, wFIB (Facilities Interface Box) Chamber Equip Cart: Included.OEM 代工型號說明
Well-established in logic, memory, and foundry fabs worldwide, eMAX provides this extensive installed base with extendibility of a proven chamber.For next generation applications, optional hardware refinements (dual-zone gas feed, multiple RF frequencies, and enhanced pumping capability) produce higher etch rates, improved uniformity, and tighter profile control while eliminating wafer-edge effects. To balance selectivity versus etch capability, especially for high aspect ratio etch, eMAX operates in a low pressure/high gas flow regime complemented by process chemistries specifically tailored to optimize resist and baselayer selectivities.Rapid wafer handling, high etch rates, and four-chamber capabilities translate into high productivity. Effective polymer deposition management through temperature controls and plasma confinement facilitates extended production runs. Longer mean time between cleans (>150 RF hours), high system throughput, 90%+ up time, and low consumables costs combine to create a production-proven, reliable, cost-effective etch system.文檔
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APPLIED MATERIALS (AMAT)
EMAX CT+ CHAMBER
已驗證
類別
Plasma Etch
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
28721
晶圓尺寸:
12"/300mm
年份:
2003
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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APPLIED MATERIALS (AMAT)
EMAX CT+ CHAMBER
已驗證
類別
Plasma Etch
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
28721
晶圓尺寸:
12"/300mm
年份:
2003
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
無描述配置
Turbo Pump: Alcatel ATH 1600M Bias: 13.5 MHz/ Daihen RMN-50M2 (P/n: 1090-10906) Throttle Valve Assy: VAT (P/N: 0010-4145) 13.56 MHz: ENI GHW-25A FIB: eFIB, wFIB (Facilities Interface Box) Chamber Equip Cart: Included.OEM 代工型號說明
Well-established in logic, memory, and foundry fabs worldwide, eMAX provides this extensive installed base with extendibility of a proven chamber.For next generation applications, optional hardware refinements (dual-zone gas feed, multiple RF frequencies, and enhanced pumping capability) produce higher etch rates, improved uniformity, and tighter profile control while eliminating wafer-edge effects. To balance selectivity versus etch capability, especially for high aspect ratio etch, eMAX operates in a low pressure/high gas flow regime complemented by process chemistries specifically tailored to optimize resist and baselayer selectivities.Rapid wafer handling, high etch rates, and four-chamber capabilities translate into high productivity. Effective polymer deposition management through temperature controls and plasma confinement facilitates extended production runs. Longer mean time between cleans (>150 RF hours), high system throughput, 90%+ up time, and low consumables costs combine to create a production-proven, reliable, cost-effective etch system.文檔
無文檔