描述
Chip-to-Substrate Thermo-Compression Bonder配置
無配置OEM 代工型號說明
Advanced packaging, flip chip thermo-compression bonding applications.文檔
無文檔
KULICKE & SOFFA (K&S)
APAMA C2S
已驗證
類別
Packaging
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
101500
晶圓尺寸:
未知
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
KULICKE & SOFFA (K&S)
APAMA C2S
類別
Packaging
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
101500
晶圓尺寸:
未知
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
Chip-to-Substrate Thermo-Compression Bonder配置
無配置OEM 代工型號說明
Advanced packaging, flip chip thermo-compression bonding applications.文檔
無文檔