Advanced packaging, flip chip thermo-compression bonding applications.

Kulicke & Soffa is a leading provider of semiconductor, LED and electronic assembly solutions serving the global automotive, consumer, communications, computing and industrial markets.

KULICKE & SOFFA (K&S)

APAMA C2S	

Chip-to-Substrate Thermo-Compression Bonder

APAMA C2S

類別

概述

活躍中的上架商品

服務

最熱門的上架商品

利用 Moov 將其上架並立即找到完美的買家。