Kulicke & Soffa is a leading provider of semiconductor, LED and electronic assembly solutions serving the global automotive, consumer, communications, computing and industrial markets.

Advanced packaging, flip chip thermo-compression bonding applications.

KULICKE & SOFFA (K&S)

APAMA C2S	

HYBRID 3

Advanced packaging, high performance and productivity die attach bonder for single or stack die bonding.

APAMA DA

Advanced packaging, thermo-compression for chip-to-wafer, high accuracy flip chip ("HA FC") and high density fan-out wafer level packaging ("HD FOWLP") bonding applications.

APAMA C2W

Spheron, a wafer level package technology that expands the capability and performance of our wafer level package product.

SPHERON

The Hybrid combines high-accuracy Flip Chip bonding directly from wafer with ultra-high-speed chip shooting.

HYBRID FC/DA

UltraCSP

The K&S Hybrid is the first hybrid Flip Chip/passive placement machine with the speed and accuracy needed for cost-effective SiP manufacture.

HYBRID SIP

ADVANCED PACKAGING (FLIP-CHIP). HIGHEST ACCURACY, HIGHEST UPH FLIP-CHIP PERFORMANCE. Kulicke & Soffa's Katalyst delivers the industry's highest accuracy and speed for flip-chip placement.  Its hardware and technology enable < 3 μm accuracy on substrate or wafer, achieving the best Cost-of-Ownership in the industry. Best-in-industry flip-chip at 15K UPH Sprint with 3 μm accuracy. Ease-of-use Automated Recipe with fully guided Setup Wizards. Automated , UPH neutral Accuracy Calibration, to avoid nozzle-to-nozzle variations during runtime. Automated thermal Drift Compensation

KULICKE & SOFFA (K&S)

概述

活躍中的上架商品

全部產品

服務

最熱門的 KULICKE & SOFFA (K&S) Packaging

APAMA C2S

HYBRID 3

APAMA DA

KATALYST

利用 Moov 將其上架並立即找到完美的買家。

所有 KULICKE & SOFFA (K&S) Packaging